Semiconductor module with heat sink and method thereof

Abstract

A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.

1 .- 25 . (canceled) 
   
   
       26 . A semiconductor module, comprising:
 a semiconductor device mounted on a printed circuit board (PCB);   a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion,   wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device.   
   
   
       27 . The semiconductor module of  claim 26 , wherein the first portion is a metal member. 
   
   
       28 . The semiconductor module of  claim 26 , wherein the second portion is a metal member. 
   
   
       29 . The semiconductor module of  claim 26 , wherein the first and second portions include at least one of copper and aluminum. 
   
   
       30 . The semiconductor module of  claim 26 , wherein the heat sink includes a heat pipe for radiating heat using a fluid. 
   
   
       31 . The semiconductor module of  claim 30 , wherein the heat sink includes an evaporation portion evaporating the fluid in the contact region. 
   
   
       32 . The semiconductor module of  claim 31 , wherein the evaporated fluid is condensed in a condensation portion. 
   
   
       33 . The semiconductor module of  claim 26 , wherein the first portion and the second portion include a bent portion. 
   
   
       34 . The semiconductor module of  claim 33 , wherein the bent portion has an angle of 180°. 
   
   
       35 . The semiconductor module of  claim 33 , wherein the heat sink includes an overlapping portion, the overlapping portion being formed by an increased thickness from the bent portion. 
   
   
       36 . The semiconductor module of  claim 35 , wherein a first height of the overlapping portion is equal to or smaller than a distance obtained by subtracting a second height of the PCB from a third height of the heat sink. 
   
   
       37 . The semiconductor module of  claim 30 , wherein the boiling point of the fluid is between 25 C° and 100 C°. 
   
   
       38 . The semiconductor module of  claim 30 , wherein the fluid includes at least one of water and alcohol. 
   
   
       39 . The semiconductor module of  claim 26 , wherein the first and second portions include at least one of copper and aluminum. 
   
   
       40 . The semiconductor module of  claim 26 , wherein the semiconductor device includes a plurality of memory devices. 
   
   
       41 . The semiconductor module of  claim 40 , wherein the plurality of memory devices are mounted on at least one side of the printed circuit board. 
   
   
       42 . The semiconductor module of  claim 26 , wherein the semiconductor module is a dual in-line memory module (DIMM).