Inventor · disambiguated record
Hae-Hyung Lee
Also filed as: LEE HAE-HYUNG
7 granted patents·5 pending applications·73 citations·filing 2004–2011
83Inventor score
Top patents by PatentIndex Score
12 records- 0190US7301233B2Semiconductor chip package with thermoelectric coolerSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 27, 2007·22 cites·20 claims
- 0284US7345882B2Semiconductor module with heat sink and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Mar 18, 2008·35 cites·23 claims
- 0374US7473993B2Semiconductor stack package and memory module with improved heat dissipationSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 6, 2009·7 cites·16 claims
- 0471US8817203B2Backlight unit and display device including the sameLEE HAE HYUNG·Filed 2011·Granted Aug 26, 2014·3 cites·20 claims
- 0568US7705449B2Cooling apparatus for memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 27, 2010·4 cites·42 claims
- 0662US7485006B2Memory module, socket and mounting method providing improved heat dissipating characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 3, 2009·2 cites·18 claims
- 0750US2009130908A1Memory module, socket and mounting method providing improved heat dissipating characteristicsPARK SANG-WOOK·Filed 2008·Application pending·0 cites
- 0847US8602624B2Backlight unit and display device having the sameLEE SANG HOON·Filed 2011·Granted Dec 10, 2013·0 cites·20 claims
- 0943US2007252257A1Semiconductor package structures having heat dissipative element directly connected to internal circuit and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1043US2008144292A1Semiconductor module with heat sink and method thereofLEE HAE-HYUNG·Filed 2008·Application pending·0 cites
- 1142US2007126114A1Heat-dissipating member, method of manufacturing the same, semiconductor module having the heat-dissipating member, and method of manufacturing the semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1234US2006006517A1Multi-chip package having heat dissipating pathLEE JIN-YANG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →