Memory module, socket and mounting method providing improved heat dissipating characteristics

Abstract

In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.

1 . A memory module comprising:
 a printed circuit board (PCB);   a tab provided on an end of the PCB;   a semiconductor device mounted on the PCB; and   a gap filler attached to the end of the PCB provided with the tab.   
   
   
       2 . The memory module of  claim 1 , wherein the PCB includes a rigid substrate. 
   
   
       3 . The memory module of  claim 1 , wherein the PCB includes a flexible substrate. 
   
   
       4 . The memory module of  claim 1 , wherein the semiconductor device is one of a semiconductor package and a wafer lever package (WLP). 
   
   
       5 . The memory module of  claim 1 , wherein the gap filler is bonded to the end of the PCB using an epoxy-based adhesive. 
   
   
       6 . The memory module of  claim 1 , wherein the gap filler is fabricated from a gel material. 
   
   
       7 . The memory module of  claim 6 , wherein a thickness of the gap filler is within a range of 0.1˜0.4 mm. 
   
   
       8 . The memory module of  claim 7 , wherein the gap filler includes one of a silica-based filler and an aluminum oxide-based filler. 
   
   
       9 . The memory module of  claim 1 , wherein a surface of the gap filler has no adhesive characteristics. 
   
   
       10 . The memory module of  claim 1 , wherein a projecting portion is provided on the tab. 
   
   
       11 . The memory module of  claim 10 , wherein the projecting portion is a protruding part of a printed circuit pattern disposed on the PCB. 
   
   
       12 . The memory module of  claim 10 , wherein the projecting portion is fabricated from a polymer. 
   
   
       13 . A socket comprising:
 a housing main body;   a module inserting portion provided in the housing main body;   at least one socket pin provided in the housing main body, the socket pin having an intermediate section confronting the module inserting portion of the housing main body; and   a gap filler provided on a surface of the module inserting portion.   
   
   
       14 . The socket of  claim 13 , wherein the socket pin has a “?” mark shape. 
   
   
       15 . The socket of  claim 13 , wherein the gap filler is bonded to a surface of the module inserting portion of the housing main body using an epoxy-based adhesive. 
   
   
       16 . The socket of  claim 13 , wherein the gap filler is fabricated from a gel material. 
   
   
       17 . The socket of  claim 13 , wherein a thickness of the gap filler is within a range of 0.1˜0.4 mm. 
   
   
       18 . The socket of  claim 13 , wherein the gap filler includes one of a silica-based filler and an aluminum oxide-based filler. 
   
   
       19 . The socket of  claim 13 , wherein a surface of the gap filler has no adhesive characteristics. 
   
   
       20 . The socket of  claim 13 , wherein the housing main body further comprises a covering portion formed on an inlet of the module inserting portion. 
   
   
       21 . The socket of  claim 20 , wherein the covering portion is fabricated from a flexible material. 
   
   
       22 . The socket of  claim 13 , wherein the housing main body further comprises:
 a filler provided on a surface of the housing main body that faces away from the module inserting portion.   
   
   
       23 . The socket of  claim 22 , wherein the filler is fabricated from an epoxy material. 
   
   
       24 . The socket of  claim 23 , wherein the epoxy material is selected from a group consisting of a silica filler, an aluminum nitride filler, an aluminum oxide filler and a carbon fiber filler. 
   
   
       25 . The socket of  claim 22 , wherein the filler is one of a TIM tape and a tape having adhesion that is reinforceable by heat. 
   
   
       26 . The socket of  claim 13 , wherein the intermediate section of the socket pin is a linear portion. 
   
   
       27 . The socket of  claim 26 , wherein a length of the linear portion is within a range of 2˜6 mm. 
   
   
       28 . A socket comprising:
 a housing main body;   a module inserting portion provided in the housing main body;   an elastic material filling a space between the module inserting portion and the housing main body;   at least one socket provided in the housing main body, the socket pin including a linear portion confronting the module inserting portion;   a socket pin lever extending from the socket pin for influencing the linear portion of the socket pin toward the module inserting portion; and   a TIM layer provided on a surface of the socket pin lever confronting the module inserting portion.   
   
   
       29 . The socket of  claim 28 , wherein the elastic material is selected from a group consisting of elastomer, epoxy-based resin, polyimide-based resin, polymer and fluoride-based resin polymer. 
   
   
       30 . The socket of  claim 28 , wherein the socket pin includes a bent portion for surface bonding to a mother board. 
   
   
       31 . The socket of  claim 28 , wherein the linear portion has a length within a range of 2˜6 mm. 
   
   
       32 . The socket of  claim 28 , wherein a width of the socket pin lever is less than one half of a width of the socket pin. 
   
   
       33 . The socket of  claim 32 , further comprising:
 a plurality of socket pins arranged in two opposing row; and   a plurality of socket pin levers respectively extending from the socket pins, the socket pin levers being separated from each other.   
   
   
       34 . The socket of  claim 28 , wherein the socket pin lever is located at a position within 1 mm from a bottom surface of the housing main body. 
   
   
       35 . The socket for memory module of  claim 28 , wherein the TIM layer is formed on two sides of the socket pin lever. 
   
   
       36 . A mounting method comprising:
 mounting a socket on a mother board;   coating a gap filler over a tab of a memory module; and   inserting the tab of the memory module into the socket.   
   
   
       37 . The mounting method of  claim 36 , further comprising:
 providing an epoxy between the socket and the mother board.   
   
   
       38 . The mounting method of  claim 36 , further comprising:
 providing a TIM layer between the socket and the mother board.   
   
   
       39 . The mounting method of  claim 36 , wherein the gap filler is an electrically insulating grease. 
   
   
       40 . The mounting method of  claim 36 , further comprising:
 filling a gap between the memory module and a surface of the socket.   
   
   
       41 . The mounting method of  claim 40 , further comprising:
 providing a gap filler on the memory module.   
   
   
       42 . The mounting method of  claim 40 , further comprising:
 providing a gap filler on a surface of the socket.   
   
   
       43 . The mounting method of  claim 36 , further comprising:
 providing a projecting portion of a printed circuit pattern of a PCB within the memory module.   
   
   
       44 . The mounting method of  claim 36 , further comprising:
 providing a projecting portion on the tab using a polymer.   
   
   
       45 . The mounting method of  claim 36 , further comprising:
 positioning a cover at an inlet of a module inserting portion of the socket.   
   
   
       46 . A system comprising:
 a socket including
 a housing main body; 
 a module inserting portion provided in the housing main body; and 
 at least one socket pin provided in the housing main body, the socket pin having an intermediate section confronting the module inserting portion of the housing main body; and 
   a memory module including
 a printed circuit board (PCB); 
 a tab provided on an end of the PCB; and 
 a semiconductor device mounted on the PCB; 
   wherein the memory module is inserted into the module inserting portion so that the tab is electrically connected to the socket pin; and   wherein a gap filler is provided between a surface of the module inserting portion and the PCB.