Nanostructure-Based Package Interconnect

Abstract

An embodiment of the present invention is an interconnect technique. A nanostructure bump is formed on a die. The nanostructure bump has a template defining nano-sized openings and metallic nano-wires extending from the nano-sized openings. The die is attached to a substrate via the nanostructure bump.

1 - 9 . (canceled) 
   
   
       10 . A nanostructure bump comprising:
 a template defining nano-sized openings disposed on a die; and   metallic nano-wires extending from the nano-sized openings that correspond to interconnect contacts on the die.   
   
   
       11 . The nanostructure bump of  claim 10  wherein the template comprises:
 an anodic aluminum oxide (AAO) template having the nano-sized openings being an ordered array of pores.   
   
   
       12 . The nanostructure bump of  claim 10  wherein the template comprises:
 a polycarbonate template having the nano-sized openings being holes etched from a polycarbonate film.   
   
   
       13 . The nanostructure bump of  claim 10  wherein the template has thickness ranging approximately from 100 nm to 500 nm. 
   
   
       14 . The nanostructure bump of  claim 10  wherein the nano-sized openings have sizes ranging approximately from 5 nm to 300 nm. 
   
   
       15 . A package comprising:
 a die;   a substrate having substrate pads; and   a nanostructure bump deposited or coated on the die and attached to the substrate at the substrate pads, the nanostructure bump comprising:
 a template defining nano-sized openings, and 
 metallic nano-wires extending from the nano-sized openings that correspond to interconnect contacts on the die. 
   
   
   
       16 . The package of  claim 15  wherein the template comprises:
 an anodic aluminum oxide (AAO) template having the nano-sized openings being an ordered array of pores.   
   
   
       17 . The package of  claim 15  wherein the template comprises:
 a polycarbonate template having the nano-sized openings being holes etched from a polycarbonate film.   
   
   
       18 . A system comprising:
 a base-band processing unit to process base-band data;   an intermediate frequency (IF) processing unit coupled to the base-band processing unit to process an IF signal; and   a system on package (SOP) coupled to the IF processing unit to process a radio frequency (RF) signal, the SOP comprising a packaged device, the packaged device comprising:
 a die, 
 a substrate having substrate pads, and 
 a nanostructure bump deposited or coated on the die and attached to the substrate at the substrate pads, the nanostructure bump comprising a template defining nano-sized openings, and metallic nano-wires extending from the nano-sized openings that correspond to interconnect contacts on the die. 
   
   
   
       19 . The system of  claim 18  wherein the template comprises:
 an anodic aluminum oxide (AAO) template having the nano-sized openings being an ordered array of pores.   
   
   
       20 . The system of  claim 18  wherein the template comprises:
 a polycarbonate template having the nano-sized openings being holes etched from a polycarbonate film.