Temperature and Condensation Control System for Functional Tester

Abstract

An innovative chip testing system and method includes controlling temperature and condensation during testing. Coarse temperature is controlled by providing a desired fluid flow rate and fluid temperature to a cold plate. Fine temperature control is provided by a feedback loop which controls the power dissipation of cartridge heaters installed within the cold plate. Condensation control is provided by insulating various components of the system, manipulation of dry compressed air in enclosures to reduce surface dew point temperatures, usage of cartridge heaters in a card backside stiffener plate, and by providing a heatsink assembly which prevents condensation on the insulation.

1 - 25 . (canceled) 
   
   
       26 . A heat sink for separating hoses entering a housing, comprising:
 a first surface, the first surface being mountable against the housing where hoses are to enter the housing;   a first plurality of holes through the first surface for passage of a first plurality of hoses through the first surface; and   a plurality of flanges positioned between the first plurality of holes such that hoses passing through the first surface of the heat sink are separated from one another by the plurality of flanges.   
   
   
       27 . The heat sink of  claim 26 , wherein the first plurality of holes non-adhesively retains insulation of the first plurality of hoses such that air access through the first plurality of holes is reduced. 
   
   
       28 . A system for testing integrated circuits, comprising:
 a card for receiving an integrated circuit;   an enclosure for limiting air movement near the integrated circuit, the enclosure substantially enclosing the integrated circuit and a cold plate, wherein the cold plate is supplied with chilled fluid through chilled fluid lines, the chilled fluid lines enter the enclosure at openings, and wherein the openings are concentrically aligned with the fluid lines and insulation on the fluid lines when the cold plate is pressed against a surface of the integrated circuit for testing, and wherein the cold plate includes at least one heater embedded within the cold plate that responds to a feedback loop that detects a temperature of the integrated circuit at various locations by use of an on chip temperature sensor embedded in the integrated circuit in order to provide automatic fine temperature control of the integrated circuit;   a control box having hoses which pass through the control box, at least some of the hoses carrying chilled fluid;   a heat sink for separating hoses entering the enclosure, wherein the heat sink includes a first surface being mountable against the enclosure where hoses are to enter the enclosure, a first plurality of holes through the first surface for passage of a first plurality of hoses through the first surface, and a plurality of flanges positioned between the first plurality of holes such that hoses passing through the first surface of the heat sink are separated from one another by the plurality of flanges; and   wherein a dry gas is injected into the enclosure and the control box.   
   
   
       29 . The heat sink of  claim 28 , wherein the first plurality of holes non-adhesively retains insulation of the first plurality of hoses such that air access through the first plurality of holes is reduced.