Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same

Abstract

This invention provides a copper alloy sheet material containing, in mass %, Ni: 0.7%-4.2% and Si: 0.2%-1.0%, optionally containing one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, and Co: 2.0% or less, and a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V, the balance being substantially Cu, and having a crystal orientation satisfying Expression (1): I {420}/ I 0 {420}>1.0,   (1) where I{420} is the x-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I 0 {420} is the x-ray diffraction intensity from the {420} crystal plane of standard pure copper powder. The copper alloy sheet material has highly improved strength, post-notching bending workability, and stress relaxation resistance property.

1 . A copper alloy sheet material comprising, in mass %, Ni: 0.7%-4.2%, Si: 0.2%-1.0%, and the balance substantially of Cu, and having a crystal orientation satisfying Expression (1):
     I{ 420 }/I   0 {420}>1.0  (1),   where I{420} is the X-ray diffraction intensity from the {420} crystal plane in the sheet plane of the copper alloy sheet material and I 0 {420} is the X-ray diffraction intensity from the {420} crystal plane of standard pure copper powder.   
     
     
         2 . The copper alloy sheet material according to  claim 1 , further having a crystal orientation satisfying Expression (2):
     I{ 220 }/I   0 {220}≦3.0  (2),   where I{220} is the X-ray diffraction intensity from the {220} crystal plane in the sheet plane of the copper alloy sheet material and I 0 {220} is the X-ray diffraction intensity from the {220} crystal plane of standard pure copper powder.   
     
     
         3 . The copper alloy sheet material according to  claim 1  having an average crystal grain diameter of 10 μm-60 μm. 
     
     
         4 . The copper alloy sheet material according to  claim 1 , further comprising one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, and Co: 2.0% or less. 
     
     
         5 . The copper alloy sheet material according to  claim 1 , further comprising a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V. 
     
     
         6 . A method of manufacturing the copper alloy sheet of  claim 1  that comprises:
 successively conducting the steps of hot rolling at 950° C.-400° C., cold rolling at a reduction ratio of 85% or greater, solution heat treatment at 700° C.-850° C., intermediate cold rolling at a reduction ratio of 0%-50%, aging at 400° C.-500° C., and finish cold rolling at a reduction ratio of 0%-50%,   in the hot rolling step of which method a first pass is conducted in a temperature range of 950° C.-700° C. and rolling is conducted in a temperature range of less than 700° C. to 400° C. at a reduction ratio of 40% or greater.   
     
     
         7 . The method of manufacturing the copper alloy sheet according to  claim 6 , in the hot rolling step of which rolling is conducted in a temperature range of 950° C.-700° C. at a reduction ratio of 60% or greater, and rolling is conducted in a temperature range of less than 700° C. to 400° C. at a reduction ratio of 40% or greater. 
     
     
         8 . The method of manufacturing the copper alloy sheet according to  claim 6 , wherein the heating time from 100° C. to 700° C. in the solution heat treatment step is 20 sec or less. 
     
     
         9 . The method of manufacturing the copper alloy sheet according to  claim 6 , in the solution heat treatment step of which heat treatment is carried out with the holding time and ultimate attaining temperature in the range of 700° C. to 850° C. set so that the average grain diameter of the recrystallization grains after the solution heat treatment becomes 10 μm-60 μm. 
     
     
         10 . The method of manufacturing the copper alloy sheet according to  claim 6 , wherein when finish cold rolling is conducted, 150° C.-550° C. low-temperature annealing is conducted after the finish cold rolling. 
     
     
         11 . The copper alloy sheet material according to  claim 2  having an average crystal grain diameter of 10 μm-60 μm. 
     
     
         12 . The copper alloy sheet material according to  claim 2 , further comprising one or more of Sn: 1.2% or less, Zn: 2.0% or less, Mg: 1.0% or less, and Co: 2.0% or less. 
     
     
         13 . The copper alloy sheet material according to  claim 2 , further comprising a total of 3% or less of one or more of Cr, B, P, Zr, Ti, Mn and V. 
     
     
         14 . A method of manufacturing the copper alloy sheet of  claim 2  that comprises:
 successively conducting the steps of hot rolling at 950° C.-400° C., cold rolling at a reduction ratio of 85% or greater, solution heat treatment at 700° C.-850° C., intermediate cold rolling at a reduction ratio of 0%-50%, aging at 400° C.-500° C., and finish cold rolling at a reduction ratio of 0%-50%,   in the hot rolling step of which method a first pass is conducted in a temperature range of 950° C.-700° C. and rolling is conducted in a temperature range of less than 700° C. to 400° C. at a reduction ratio of 40% or greater.   
     
     
         15 . The method of manufacturing the copper alloy sheet according to  claim 14 , in the hot rolling step of which rolling is conducted in a temperature range of 950° C.-700° C. at a reduction ratio of 60% or greater, and rolling is conducted in a temperature range of less than 700° C. to 400° C. at a reduction ratio of 40% or greater. 
     
     
         16 . The method of manufacturing the copper alloy sheet according to  claim 15 , wherein the heating time from 100° C. to 700° C. in the solution heat treatment step is 20 sec or less. 
     
     
         17 . The method of manufacturing the copper alloy sheet according to  claim 15 , in the solution heat treatment step of which heat treatment is carried out with the holding time and ultimate attaining temperature in the range of 700° C. to 850° C. set so that the average grain diameter of the recrystallization grains after the solution heat treatment becomes 10 μm-60 μm. 
     
     
         18 . The method of manufacturing the copper alloy sheet according to  claim 15 , wherein when finish cold rolling is conducted, 150° C.-550° C. low-temperature annealing is conducted after the finish cold rolling.