Process for structuring a surface layer

Abstract

A process for structuring a surface layer of an object includes applying bio-components to the surface of the object that carry away surface material. The bio-components are contained in at least one of a nutrient and osmotic protective medium. The at least one of a nutrient and osmotic protective medium having the bio-components contained therein is removed after the surface material is carried away from the object surface.

1 . A method of structuring a surface layer of an object, comprising:
 contacting a surface of the object with a bio-component selected from the group consisting of a membrane-enclosed compartment, an antibody, an antigen, a receptor, a virus, a micelle, a macromolecule, and a combination thereof, wherein the bio-component is present in at least one of a nutrient medium and an osmotic protective medium for the bio-component;   structuring the surface layer of the object by maintaining the bio-component present in the medium in contact with the surface of the object for a period of time such that the bio-component removes a material from the surface or deposits on the surface the bio-component or a material derived from the bio-component; and   removing the at least one of a nutrient medium and an osmotic protective medium after the surface layer of the object is structured.   
     
     
         2 . The method of  claim 1 , wherein the membrane-enclosed compartment is selected from the group consisting of a biological cell, a membrane vesicle, and an organelle. 
     
     
         3 . The method of  claim 1 , wherein the macromolecule is selected from the group consisting of a polypeptide, a polysaccharide, a polynucleotide, a pigment, and a lipid. 
     
     
         4 . The method of  claim 1 , wherein the object is a semiconductor wafer. 
     
     
         5 . The method of  claim 4 , wherein in the step of structuring the surface layer of the object, the bio-component changes an electric parameter of the surface of the semiconductor wafer. 
     
     
         6 . The method of  claim 4 , wherein in the step of structuring the surface layer of the object, the bio-component removes an impurity from the surface of the semiconductor wafer. 
     
     
         7 . The method of  claim 4 , wherein in the step of structuring the surface layer of the object, the bio-component deposits a precipitation product from the bio-component on the surface of the semiconductor wafer. 
     
     
         8 . The method of  claim 7 , wherein the precipitation product is a protein, a pigment, or an analyte that precipitates out of a biological cell. 
     
     
         9 . The method of  claim 4 , wherein in the step of structuring the surface layer of the object, the bio-component deposits in an adherent manner on the surface of the semiconductor wafer. 
     
     
         10 . The method of  claim 9 , wherein the bio-component is a biological cell. 
     
     
         11 . The method of  claim 10 , wherein the biological cell functions as a dielectric on the surface of the semiconductor wafer. 
     
     
         12 . The method of  claim 4 , wherein the bio-component is surface-structure selective and the surface layer of the semiconductor wafer is selectively structured without the use of a mask. 
     
     
         13 . The method of  claim 12 , wherein the bio-component is a biological cell. 
     
     
         14 . The method of  claim 13 , wherein the biological cell is an LS174T cell. 
     
     
         15 . An object having a surface layer structured by a method of  claim 1 . 
     
     
         16 . The object of  claim 15 , wherein the object is a semiconductor wafer. 
     
     
         17 . The object of  claim 15 , wherein the biological component is an LS174T cell.