US2008238582A1PendingUtilityA1

Flexible Capacitive Coupler Assembly And Method Of Manufacture

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Assignee: IBMPriority: Oct 3, 2002Filed: Jun 6, 2008Published: Oct 2, 2008
Est. expiryOct 3, 2022(expired)· nominal 20-yr term from priority
H10W 90/20H10W 72/00H10W 90/00H10W 90/293G06F 1/18Y10S439/95G06F 1/1683
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Claims

Abstract

A flexible capacitive coupler assembly includes a flexible dielectric substrate assembly having a front surface and a rear surface, the front surface having thereon a macroscopic metal capacitive pad. A package supports the flexible dielectric substrate. An electrical connection is made to package wiring or leads on the flexible dielectric substrate to establish electrical contact with a computer subsystem.

Claims

exact text as granted — not AI-modified
1 . A method of manufacturing a flexible capacitive coupler comprising:
 obtaining a flexible dielectric substrate;   patterning macroscopic metal capacitive pads on a front surface of the flexible dielectric substrate;   securing the flexible dielectric substrate to a package to mechanically support the flexible dielectric substrate; and   establishing an electrical connection between the macroscopic metal capacitive pads and a computer subsystem.

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