Inventor · disambiguated record
Matthew J. Farinelli
Also filed as: FARINELLI MATTHEW · FARINELLI MATTHEW J · FARINELLI MATTHEW JAMES
21 granted patents·8 pending applications·168 citations·filing 2001–2012
95Inventor score
Top patents by PatentIndex Score
29 records- 0193US7932514B2Microwave readout for flux-biased qubitsIBM·Filed 2008·Granted Apr 26, 2011·57 cites·16 claims
- 0290US7452212B2Metalized elastomeric electrical contactsIBM·Filed 2005·Granted Nov 18, 2008·16 cites·1 claims
- 0387US8745850B2Method of manufacturing superconducting low pass filter for quantum computingFARINELLI MATTHEW J·Filed 2009·Granted Jun 10, 2014·21 cites·12 claims
- 0484US8679280B2Laser ablation of adhesive for integrated circuit fabricationDANG BING·Filed 2010·Granted Mar 25, 2014·7 cites·19 claims
- 0583US8551816B2Direct edge connection for multi-chip integrated circuitsCORDES STEVEN A·Filed 2012·Granted Oct 8, 2013·6 cites·6 claims
- 0682US8294138B2Microwave readout for flux-biased qubitsFARINELLI MATTHEW J·Filed 2011·Granted Oct 23, 2012·15 cites·12 claims
- 0774US7771208B2Metalized elastomeric electrical contactsIBM·Filed 2008·Granted Aug 10, 2010·5 cites·34 claims
- 0873US8832936B2Method of forming metallized elastomeric electrical contactsHOUGHAM GARETH GEOFFREY·Filed 2009·Granted Sep 16, 2014·5 cites·14 claims
- 0973US8237271B2Direct edge connection for multi-chip integrated circuitsCORDES STEVEN A·Filed 2007·Granted Aug 7, 2012·5 cites·10 claims
- 1073US7385457B2Flexible capacitive coupler assembly and method of manufactureIBM·Filed 2006·Granted Jun 10, 2008·4 cites·19 claims
- 1167US8054095B2Metalized elastomeric probe structureIBM·Filed 2005·Granted Nov 8, 2011·4 cites·38 claims
- 1265US7688095B2Interposer structures and methods of manufacturing the sameIBM·Filed 2007·Granted Mar 30, 2010·2 cites·15 claims
- 1365US7456640B2Structure for coupling probes of probe device to corresponding electrical contacts on product substrateIBM·Filed 2006·Granted Nov 25, 2008·6 cites·20 claims
- 1459US6679625B2Scanning heat flow probeIBM·Filed 2001·Granted Jan 20, 2004·6 cites·8 claims
- 1557US8159248B2Interposer structures and methods of manufacturing the sameCORDES STEVEN A·Filed 2009·Granted Apr 17, 2012·2 cites·19 claims
- 1655US8524596B2Techniques for improving bond pad performanceBEAULIEU FREDERIC·Filed 2012·Granted Sep 3, 2013·1 cites·20 claims
- 1752US6652139B2Scanning heat flow probe and the method of fabricating the sameIBM·Filed 2003·Granted Nov 25, 2003·3 cites·8 claims
- 1852US2008238582A1Flexible Capacitive Coupler Assembly And Method Of ManufactureIBM·Filed 2008·Application pending·0 cites
- 1949US6817761B2Scanning heat flow probeIBM·Filed 2003·Granted Nov 16, 2004·2 cites·4 claims
- 2048US2009311849A1Methods of separating integrated circuit chips fabricated on a waferIBM·Filed 2008·Application pending·0 cites
- 2147US8081280B2Method of producing UV stable liquid crystal alignmentCHIU GEORGE LIANG-TAI·Filed 2007·Granted Dec 20, 2011·0 cites·22 claims
- 2247US6866415B2Scanning heat flow probeIBM·Filed 2003·Granted Mar 15, 2005·1 cites·5 claims
- 2347US2009001248A1Methods of Creating Molds of Variable Solder Volumes for Flip AttachFARINELLI MATTHEW J·Filed 2007·Application pending·0 cites
- 2447US2009004840A1Method of Creating Molds of Variable Solder Volumes for Flip AttachFARINELLI MATTHEW J·Filed 2007·Application pending·0 cites
- 2543US2006244138A1Techniques for improving bond pad performanceIBM·Filed 2005·Application pending·0 cites
- 2641US2012091585A1Laser release process for very thin si-carrier buildBUCHWALTER LEENA P·Filed 2011·Application pending·0 cites
- 2739US8187923B2Laser release process for very thin Si-carrier buildANDRY PAUL STEPHEN·Filed 2008·Granted May 29, 2012·0 cites·10 claims
- 2837US2006024861A1Interposer structures and improved processes for use in probe technologies for semiconductor manufacturingIBM·Filed 2004·Application pending·0 cites
- 2936US2008036084A1Laser release process for very thin Si-carrier buildIBM·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →