US2009001248A1PendingUtilityA1

Methods of Creating Molds of Variable Solder Volumes for Flip Attach

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Assignee: FARINELLI MATTHEW JPriority: Jun 27, 2007Filed: Aug 23, 2007Published: Jan 1, 2009
Est. expiryJun 27, 2027(~0.9 yrs left)· nominal 20-yr term from priority
Inventors:Matthew J. FarinelliSteven A. CordesDonna S. NielsenSamuel McknightJay S. CheyPeter A. GruberJoanna Rosner
H10W 74/00H10W 72/252H10W 72/222H10W 72/01204H05K 3/3465H05K 2203/0338H05K 2203/0113
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Claims

Abstract

A solder mold includes a substrate and a plurality of cavities for holding solder to be transferred to an integrated circuit. The plurality of cavities comprises cavities of at least two different volumes.

Claims

exact text as granted — not AI-modified
1 . A solder mold comprising:
 a solder mold substrate; and   a plurality of cavities within the substrate for holding solder to be transferred to an integrated circuit, wherein the plurality of cavities comprises cavities of at least two different volumes,   wherein the plurality of cavities comprises cavities that recur with at least two different spatial intervals.   
   
   
       2 . (canceled) 
   
   
       3 . The solder mold of  claim 1 , wherein the substrate comprises glass. 
   
   
       4 . The solder mold of  claim 1 , wherein the substrate has anisotropic etching properties. 
   
   
       5 . The solder mold of  claim 1 , wherein the substrate comprises crystalline silicon. 
   
   
       6 . The solder mold of  claim 1 , wherein the plurality of cavities are each square-shaped or rectangle-shaped. 
   
   
       7 . A solder mold comprising:
 a solder mold substrate; and   a plurality of cavities within the substrate for holding solder to be transferred to an integrated circuit, wherein the plurality of cavities comprises cavities of at least a first volume and a second volume, wherein the first volume is about 10% larger than the second volume.   
   
   
       8 . The solder mold of  claim 7 , wherein the plurality of cavities comprises cavities that recur with at least two different spatial intervals 
   
   
       9 . The solder mold of  claim 7 , wherein the substrate comprises glass. 
   
   
       10 . The solder mold of  claim 7 , wherein the substrate has anisotropic etching properties. 
   
   
       11 . The solder mold of  claim 7 , wherein the substrate comprises crystalline silicon. 
   
   
       12 . The solder mold of  claim 7 , wherein the plurality of cavities are each square-shaped or rectangle-shaped. 
   
   
       13 . A solder mold comprising:
 a solder mold substrate; and   a plurality of cavities within the substrate for holding solder to be transferred to an integrated circuit, wherein the plurality of cavities comprises cavities of at least a first volume that is about 1.886 mil 3  and a second volume that is about 0.236 mil 3 .   
   
   
       14 . The solder mold of  claim 13 , wherein the plurality of cavities comprises cavities that recur with at least two different spatial intervals 
   
   
       15 . The solder mold of  claim 13 , wherein the substrate comprises glass. 
   
   
       16 . The solder mold of  claim 13 , wherein the substrate has anisotropic etching properties. 
   
   
       17 . The solder mold of  claim 13 , wherein the substrate comprises crystalline silicon. 
   
   
       18 . The solder mold of  claim 13 , wherein the plurality of cavities are each square-shaped or rectangle-shaped.

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