Pad assemblies for electrochemically assisted planarization

Abstract

In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, wherein the intermediate layer contains a plurality of perforations, channels, or combinations thereof, which have diameters within a range from about 0.5 mm to about 10 mm, and a second conductive layer coupled to the intermediate layer, wherein the second conductive layer has a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement. The intermediate layer may contain a polymer material support disk, a backing layer, or combinations thereof. Generally, the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body.

1 . A pad assembly for electro-processing a substrate, comprising:
 a first conductive layer having a working surface to contact a substrate during a polishing process;   an intermediate layer coupled to the first conductive layer, wherein the intermediate layer comprises a plurality of perforations, channels, or combinations thereof, and the perforations or channels have diameters within a range from about 0.5 mm to about 10 mm; and   a second conductive layer coupled to the intermediate layer, wherein the second conductive layer has a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement.   
   
   
       2 . The pad assembly of  claim 1 , wherein the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body. 
   
   
       3 . The pad assembly of  claim 1 , wherein the first conductive layer comprises a dielectric body and at least one conductive element. 
   
   
       4 . The pad assembly of  claim 3 , wherein the dielectric body comprises a polymeric material. 
   
   
       5 . The pad assembly of  claim 4 , wherein the polymeric material is selected from the group consisting of polyurethane, polycarbonate, polyphenylene sulfide, polyethylene, and combinations thereof. 
   
   
       6 . The pad assembly of  claim 4 , wherein the polymeric material is a fluoropolymeric material. 
   
   
       7 . The pad assembly of  claim 1 , wherein the first conductive layer is at least one of permeable to electrolyte or contains perforations. 
   
   
       8 . The pad assembly of  claim 1 , wherein the first conductive layer further comprises a plurality of conductive elements adapted to deliver a current to the working surface. 
   
   
       9 . The pad assembly of  claim 8 , wherein the first conductive layer comprises a dielectric body and the plurality of conductive elements are configured to be coupled with the power delivery arrangement. 
   
   
       10 . The pad assembly of  claim 1 , wherein the working surface further comprises at least one of grooves, embossment, or other texturing formed therein. 
   
   
       11 . The pad assembly of  claim 1 , further comprising at least one contact element extending through the pad assembly and adapted to deliver a current to the working surface. 
   
   
       12 . The pad assembly of  claim 1 , wherein the intermediate layer comprises a polymer material support disk, a backing layer, or combinations thereof. 
   
   
       13 . The pad assembly of  claim 1 , wherein the second conductive layer further comprises a plurality of concentric conductive elements. 
   
   
       14 . The pad assembly of  claim 1 , wherein the second conductive layer further comprises conductive elements comprising a material selected from the group consisting of copper, graphite, titanium, platinum, and gold. 
   
   
       15 . A pad assembly for electro-processing a substrate, comprising:
 a first conductive layer having a working surface to contact a substrate, wherein the first conductive layer comprises a dielectric body and at least one conductive element, and the dielectric body comprises a polymeric material selected from the group consisting of polyurethane, polycarbonate, polyphenylene sulfide, polyethylene, fluoropolymeric material, and combinations thereof;   a second conductive layer having a plurality of independently electrically biasable zones and is configured to be coupled with a power delivery arrangement; and   an intermediate layer between and coupled with the first conductive layer and the second conductive layer, wherein the intermediate layer comprises a polymer material support disk, a backing layer, or a combination thereof.   
   
   
       16 . The pad assembly of  claim 15 , wherein the first conductive layer, the second conductive layer, and the intermediate layer are adhered or secured together and removable as a unitary replaceable body. 
   
   
       17 . The pad assembly of  claim 15 , wherein the intermediate layer comprises a plurality of perforations, channels, or combinations thereof, and. 
   
   
       18 . The pad assembly of  claim 17 , wherein the perforations or channels have diameters within a range from about 0.5 mm to about 10 mm. 
   
   
       19 . The pad assembly of  claim 15 , wherein the first conductive layer further comprises a plurality of conductive elements adapted to deliver a current to the working surface. 
   
   
       20 . The pad assembly of  claim 19 , wherein the conductive elements are configured to be coupled with the power delivery arrangement. 
   
   
       21 . The pad assembly of  claim 15 , wherein the first conductive layer is at least one of permeable to electrolyte or contains perforations. 
   
   
       22 . The pad assembly of  claim 15 , further comprising at least one contact element extending through the pad assembly and adapted to deliver a current to the working surface. 
   
   
       23 . The pad assembly of  claim 15 , wherein the second conductive layer further comprises a plurality of concentric conductive elements. 
   
   
       24 . The pad assembly of  claim 15 , wherein the second conductive layer further comprises conductive elements comprising a material selected from the group consisting of copper, graphite, titanium, platinum, and gold. 
   
   
       25 . A method of processing a substrate surface, comprising:
 disposing a substrate having a conductive material layer formed thereon within a process apparatus comprising an electrode having a plurality of zones and a polishing pad having a plurality of zones corresponding to the plurality of zones of the electrode, wherein the polishing pad further comprises:
 a first conductive layer having a working surface to contact the substrate during a polishing process; 
 an intermediate layer coupled to the first conductive layer; and 
 a second conductive layer coupled to the intermediate layer; 
   contacting the polishing pad and the substrate;   providing relative motion between the polishing pad and the substrate; and   separately applying a plurality of biases between the plurality of zones of the polishing pad and the plurality of zones of the electrode.