Apparatus for providing controlled impedance in an electrical contact

Abstract

An apparatus for providing a controlled impedance directly to predetermined contact elements within a socket, thereby reducing the “distorting” nature of the electrical interconnection system. In an illustrative embodiment of the present invention, predetermined contacts of a socket may have a resistance, inductance, capacitance, or a combination thereof incorporated therein. In another illustrative embodiment, at least one active element(s) may also be incorporated into predefined contacts. In this manner, predefined contacts may “process” the corresponding signal in a predetermined manner, defined by the circuitry incorporated on the contact itself. Illustrative functions that may be performed include, but are not limited to, amplifying, analog-to-digital converting, digital-to-analog converting, predefined logic functions, or any other function that may be performed via a combination of active and/or passive elements including a microprocessor function.

1 - 39 . (canceled) 
   
   
       40 . Apparatus for electrically interconnecting leads of a packaged semiconductor device to corresponding pads spaced at a distance from the leads, comprising:
 (a) a housing, said housing having contact receiving slots formed therein, said housing having a surface intersected by said contact receiving slots, each of said contact receiving slots extending substantially parallel to an axis extending between a spaced corresponding lead and pad, said packaged semiconductor being able to be positioned relative to said housing proximate said contact receiving slots;   (b) a lead from said semiconductor engaging one of a plurality of contacts received within a contact receiving slot, and further engagable a corresponding pad, wherein each spaced pad completes a signal path, each of said contact providing means for electrically affecting a signal transisting said signal path between at least two spaced pads; and   (c) each of said contacts comprising a device element and a plate separated by a layer of dielectric material, wherein said dielectric material has a thickness substantially equal to a distance between said device element and said plate, and wherein each lead engages a first portion of the corresponding contact device element, said contact device element having a second portion opposite the first portion, and wherein the second portion engages at least one spaced pad comprising an I/O pad, and wherein length and width dimensions of each device element and corresponding plate differ.   
   
   
       41 . (canceled) 
   
   
       42 . Apparatus according to  claim 40  wherein said dielectric material is mechanically bonded to said device element and plates. 
   
   
       43 . Apparatus according to  claim 42  wherein said dielectric material further comprises a native grown metal oxide. 
   
   
       44 . Apparatus according to  claim 43  comprising a plurality of slots and wherein said plurality of contacts is coupled to a plurality of pads. 
   
   
       45 - 48 . (canceled) 
   
   
       49 . Apparatus according to  claim 40  wherein each of said contact receiving slots receives a corresponding lead of the packaged semiconductor device leads. 
   
   
       50 . (canceled) 
   
   
       51 . Apparatus as in  claim 40  wherein the contact plate is positioned to engage at least one spaced pad comprising a ground pad wherein the contact device element and contact plate are arranged such that the construct yields a micro-type type impedance controlled active contact transmission line structure.