Methods of Making Molybdenium Titanium Sputtering Plates and Targets

Abstract

Molybdenum titanium sputter targets are provided. In one aspect, the targets are substantially free of the β(Ti, Mo) alloy phase. In another aspect, the targets are substantially comprised of single phase β(Ti, Mo) alloy. In both aspects, particulate emission during sputtering is reduced. Methods of preparing the targets, methods of bonding targets together to produce large area sputter targets, and films produced by the targets, are also provided.

1 - 9 . (canceled) 
     
     
         10 . A method of preparing a molybdenum-titanium sputtering target having a single β(Ti,Mo) phase, the method comprising the steps of:
 (a) providing powders of molybdenum and titanium wherein said titanium powder is present in an amount of about 5-95 atomic %, based on the total atomic % of the molybdenum and titanium powders, the balance being molybdenum powder;   (b) blending the molybdenum and titanium powders to produce a blended powder;   (c) optionally, consolidating the blended powder;   (d) encapsulating the consolidated powder; and   (e) compacting while heating the encapsulated powder to produce a MoTi target plate having a single β(MoTi) phase.   
     
     
         11 . The method of  claim 10 , wherein in step (e) the compacting is performed at a pressure of 75-300 MPa and the heating is carried out at a temperature of 900°-1650° C. for a period of 2-16 hours. 
     
     
         12 . The method of  claim 10 , wherein the molybdenum powder has an average particle size of 0.1-25 microns. 
     
     
         13 . The method of  claim 10 , wherein the titanium powder has an average particle size of 5-50 microns. 
     
     
         14 . The method of  claim 10 , wherein the consolidating of step (c) is performed in a cold isostatic press. 
     
     
         15 . The method of  claim 10 , wherein the compacting/heating of step (e) is performed in a hot isostatic press. 
     
     
         16 . A method of bonding two or more sputter target plates together to produce a large area sputter target, the method comprising:
 (a) cleaning an edge of each of the two or more target plates;   (b) optionally, providing a bonding material on an edge of at least one of the two or more target plates to be bonded;   (e) encapsulating the two or more target plates; and   (d) compacting while heating the two or more target plates to produce a large area sputter target plate,   wherein the large area sputter target plate is at least 55 in. by 67 in. in area.   
     
     
         17 . The method of  claim 16 , wherein each of the two or more target plates has a thickness of ½ inch to 36 inches along the edge to be bonded. 
     
     
         18 . The method of  claim 16 , wherein each of the two or more target plates has a thickness of 4-8 inches along the edge to be bonded. 
     
     
         19 . The method of  claim 16 , wherein the target plates are comprised of molybdenum and titanium. 
     
     
         20 . The method of  claim 16 , wherein a bonding material of titanium powder is used. 
     
     
         21 . The method of  claim 16 , wherein a bonding material of titanium foil is used. 
     
     
         22 . The method of  claim 16 , wherein a bonding material of titanium-molybdenum powder is used. 
     
     
         23 . The method of  claim 16 , wherein the compacting and heating step is hot isostatic pressing and is carried out at a pressure of 75-300 MPa and a temperature of 700°-950° C. 
     
     
         24 . (canceled) 
     
     
         25 . A molybdenum-titanium film produced by sputtering the target produced by the method of  claim 10 . 
     
     
         26 . A molybdenum-titanium sputtering target having an area of at least 55 inches by 67 inches. 
     
     
         27 . A molybdenum-titanium sputtering target having substantially no β(Mo, Ti) alloy phase. 
     
     
         28 . The molybdenum-titanium sputtering target of  claim 27 , wherein the target has a density that is at least 95% of theoretical density. 
     
     
         29 . A molybdenum-titanium sputtering target having a single β(Mo, Ti) alloy phase. 
     
     
         30 . The molybdenum-titanium sputtering target of  claim 29 , wherein
 the target has a density that is at least 95% of theoretical density.