US2008316846A1PendingUtilityA1

Semiconductor memory device capable of storing data of various patterns and method of electrically testing the semiconductor memory device

Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Nov 11, 2004Filed: Aug 29, 2008Published: Dec 25, 2008
Est. expiryNov 11, 2024(expired)· nominal 20-yr term from priority
G11C 29/10G11C 29/1201G11C 29/48G11C 29/00
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Claims

Abstract

A semiconductor memory device to which information of different data bits can be written, and a method of electrically testing the semiconductor memory device are provided. In a mode for testing a memory cell array of the semiconductor memory device, the semiconductor memory comprises a control signal generation pad capable of writing non-identical data to data input/output pads of each group when data is written to the memory cell array.

Claims

exact text as granted — not AI-modified
1 . A semiconductor memory device comprising:
 a memory cell array storing data;   a plurality of address pads used to designate the memory cell array;   a plurality of data input/output pads for reading data from and writing data to the memory cell array, the plurality of data input/output pads divided into a plurality of data input/output groups during a test mode for the memory cell array; and   a control signal generation pad capable of writing non-identical data to the plurality of data input/output pads of each group when data is written to the memory cell array during the test mode.   
   
   
       2 . The semiconductor memory device of  claim 1 , further comprising a data input multiplexer (DINMUX) coupled to the control signal generation pad. 
   
   
       3 . The semiconductor memory device of  claim 2 , wherein the data input multiplexer (DINMUX) controls designation of the plurality of data input/output pads according to the frequency of toggling of a control signal. 
   
   
       4 . The semiconductor memory device of  claim 1 , wherein the control signal generation pad is a control pin not used in the test mode for the memory cell array. 
   
   
       5 . The semiconductor memory device of  claim 1 , wherein the plurality of data input/output pads of each group are connected to one input/output (I/O) channel of a tester when the memory cell array is tested. 
   
   
       6 . The semiconductor memory device of  claim 1 , wherein the device comprises 2N (N is a natural number) data input/output pads in each group of the plurality of data input/output pads. 
   
   
       7 . The semiconductor memory device of  claim 1 , wherein the test mode for the memory cell array is a mode for a writing function of 2 m (m is a natural number) memory cells. 
   
   
       8 . The semiconductor memory device of  claim 1 , wherein the test mode for the memory cell array is included in an electrical die sort (EDS) test. 
   
   
       9 . The semiconductor memory device of  claim 1 , wherein the test mode for the memory cell array is included in a final electrical test.

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