US2008316846A1PendingUtilityA1
Semiconductor memory device capable of storing data of various patterns and method of electrically testing the semiconductor memory device
Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Nov 11, 2004Filed: Aug 29, 2008Published: Dec 25, 2008
Est. expiryNov 11, 2024(expired)· nominal 20-yr term from priority
G11C 29/10G11C 29/1201G11C 29/48G11C 29/00
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Claims
Abstract
A semiconductor memory device to which information of different data bits can be written, and a method of electrically testing the semiconductor memory device are provided. In a mode for testing a memory cell array of the semiconductor memory device, the semiconductor memory comprises a control signal generation pad capable of writing non-identical data to data input/output pads of each group when data is written to the memory cell array.
Claims
exact text as granted — not AI-modified1 . A semiconductor memory device comprising:
a memory cell array storing data; a plurality of address pads used to designate the memory cell array; a plurality of data input/output pads for reading data from and writing data to the memory cell array, the plurality of data input/output pads divided into a plurality of data input/output groups during a test mode for the memory cell array; and a control signal generation pad capable of writing non-identical data to the plurality of data input/output pads of each group when data is written to the memory cell array during the test mode.
2 . The semiconductor memory device of claim 1 , further comprising a data input multiplexer (DINMUX) coupled to the control signal generation pad.
3 . The semiconductor memory device of claim 2 , wherein the data input multiplexer (DINMUX) controls designation of the plurality of data input/output pads according to the frequency of toggling of a control signal.
4 . The semiconductor memory device of claim 1 , wherein the control signal generation pad is a control pin not used in the test mode for the memory cell array.
5 . The semiconductor memory device of claim 1 , wherein the plurality of data input/output pads of each group are connected to one input/output (I/O) channel of a tester when the memory cell array is tested.
6 . The semiconductor memory device of claim 1 , wherein the device comprises 2N (N is a natural number) data input/output pads in each group of the plurality of data input/output pads.
7 . The semiconductor memory device of claim 1 , wherein the test mode for the memory cell array is a mode for a writing function of 2 m (m is a natural number) memory cells.
8 . The semiconductor memory device of claim 1 , wherein the test mode for the memory cell array is included in an electrical die sort (EDS) test.
9 . The semiconductor memory device of claim 1 , wherein the test mode for the memory cell array is included in a final electrical test.Join the waitlist — get patent alerts
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