Integrated circuit probing apparatus having a temperature-adjusting mechanism

Abstract

A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.

1 . An integrated circuit probing apparatus, comprising:
 a circuit board having a first surface and a second surface;   at least one probe positioned on the circuit board, the probe being configured to electrically contact an integrated circuit device facing the first surface; and   a temperature-adjusting mechanism positioned on the second surface, the temperature-adjusting mechanism including at least one flow line positioned on the second surface of the circuit board, and the flow line includes at least one fluid inlet and a plurality of fluid outlets.   
   
   
       2 . The integrated circuit probing apparatus of  claim 1 , wherein the flow line permits a fluid to flow therein, and the fluid is gas, liquid or the combination thereof. 
   
   
       3 . The integrated circuit probing apparatus of  claim 1 , wherein the flow line is a guiding tube. 
   
   
       4 . An integrated circuit probing apparatus, comprising:
 a circuit board having a first surface and a second surface;   at least one probe positioned on the circuit board, the probe being configured to electrically contact an integrated circuit device facing the first surface;   a holder configured to support the circuit board; and   a temperature-adjusting mechanism positioned in the holder or on the holder.   
   
   
       5 . The integrated circuit probing apparatus of  claim 4 , wherein the temperature-adjusting mechanism is a flow line positioned in the holder. 
   
   
       6 . The integrated circuit probing apparatus of  claim 5 , wherein the flow line permits a fluid to flow therein, and the fluid is gas, liquid or the combination thereof. 
   
   
       7 . The integrated circuit probing apparatus of  claim 5 , wherein the flow line includes at least one fluid inlet and a plurality of fluid outlets. 
   
   
       8 . The integrated circuit probing apparatus of  claim 5 , wherein the temperature-adjusting mechanism is a guiding tube positioned on the holder, and the guiding tube includes at least one fluid inlet and a plurality of fluid outlets. 
   
   
       9 . An integrated circuit probing apparatus, comprising:
 a circuit board having a first surface and a second surface;   at least one probe positioned on the circuit board, the probe being able to electrically contact an integrated circuit device facing the first surface;   a test head positioned above the second surface; and   a temperature-adjusting mechanism positioned in the test head or on the test head.   
   
   
       10 . The integrated circuit probing apparatus of  claim 9 , wherein the test head includes a plurality of pins capable of forming electrical connections with a plurality of connecting sites on the second surface of the circuit board. 
   
   
       11 . The integrated circuit probing apparatus of  claim 9 , wherein the temperature-adjusting mechanism is a flow line having at least one fluid inlet and a plurality of fluid outlets. 
   
   
       12 . The integrated circuit probing apparatus of  claim 11 , wherein the flow line permits a fluid to flow therein, and the fluid is gas, liquid or the combination thereof. 
   
   
       13 . The integrated circuit probing apparatus of  claim 11 , wherein the flow line is a guiding tube. 
   
   
       14 . The integrated circuit probing apparatus of  claim 9 , wherein the test head includes a test interface or test measurement unit capable of forming electrical connections with a plurality of connecting sites on the second surface of the circuit board.