Circuit board structure with concave conductive cylinders and method for fabricating the same

Abstract

A method for fabricating a circuit board structure with concave conductive cylinders is provided. Firstly, a conductive layer is provided; a plurality of conductive cylinders are formed on a surface of the conductive layer; a dielectric layer is formed on the surface of the conductive layer with the conductive cylinders; the tips of the conductive cylinders are exposed on a surface of the dielectric layer far away from the conductive layer; removing the exposed tips of the conductive cylinders such that the height of the conductive cylinders is lower than the height of the dielectric layer, and the conductive cylinders sunk into the dielectric layer.

1 . A method for fabricating a circuit board structure with concave conductive cylinders, comprising:
 providing a conductive layer;   forming a plurality of conductive cylinders on a surface of the conductive layer;   forming a dielectric layer on the surface of the conductive layer;   exposing the tips of the conductive cylinders on a surface of the dielectric layer far away from the conductive layer; and   removing the exposed tips of the conductive cylinders, so that the height of the conductive cylinders is relatively lower than the dielectric layer and the conductive cylinders sunk into the dielectric layer.   
   
   
       2 . The method for fabricating a circuit board structure with concave conductive cylinders of  claim 1 , wherein the step of forming the conductive cylinders comprises:
 partially etching the conductive layer.   
   
   
       3 . The method for fabricating a circuit board structure with concave conductive cylinders of  claim 1 , wherein the step of forming the dielectric layer comprises:
 laminating or printing a dielectric material on the surface of the conductive layer.   
   
   
       4 . The method for fabricating a circuit board structure with concave conductive cylinders of  claim 1 , wherein the step of removing the exposed tips of the conductive cylinders comprises grinding or etching. 
   
   
       5 . The method for fabricating a circuit board structure with concave conductive cylinders of  claim 1 , wherein after removing the exposed tips of the conductive cylinders, further comprises:
 disposing a solder material on the conductive cylinders sunk into the dielectric layer, so as to rise the solder material above the dielectric layer.   
   
   
       6 . A method for fabricating a circuit board structure with concave conductive cylinders, comprises:
 providing a conductive layer;   forming a dielectric layer on a surface of the conductive layer;   forming a plurality of vias in the dielectric layer, wherein the vias expose the surface of the conductive layer;   filling a conductive material in the vias to form a plurality of conductive cylinders on the surface of the conductive layer, so that the tips of these conductive cylinders are exposed on a surface of the dielectric layer far away from the conductive layer; and   removing the exposed tips of the conductive cylinders, so that the height of the conductive cylinders is relatively lower than the dielectric layer and the conductive cylinders sunk into the dielectric layer.   
   
   
       7 . The method for fabricating a circuit board structure with concave conductive cylinders of  claim 6 , wherein the step of forming the dielectric layer comprises:
 laminating or printing a dielectric material on the surface of the conductive layer.   
   
   
       8 . The method for fabricating a circuit board structure with concave conductive cylinders of  claim 6 , wherein the method of forming the vias comprises laser drilling. 
   
   
       9 . The method for fabricating a circuit board structure with concave conductive cylinders of  claim 6 , wherein the method of filling the conductive material in the vias includes printing and filling, electroplating, sputtering or vapour deposition method. 
   
   
       10 . The method for fabricating a circuit board structure with concave conductive cylinders of  claim 9 , wherein the conductive material filled in the vias comprise copper, copper paste, silver paste or conductive polymeric material. 
   
   
       11 . The method for fabricating a circuit board structure with concave conductive cylinders of  claim 6 , wherein the material filled in these vias comprise copper, copper paste, silver paste or conductive polymeric material. 
   
   
       12 . The method for fabricating a circuit board structure with concave conductive cylinders of  claim 6 , wherein the steps of removing the exposed tips of the conductive cylinders comprises grinding or etching. 
   
   
       13 . The method for fabricating a circuit board structure with concave conductive cylinders of  claim 6 , wherein after removing the exposed tips of the conductive cylinders, further comprises:
 disposing a solder material on the conductive cylinders sunk into the dielectric layer, so as to rise the solder material above the dielectric layer.   
   
   
       14 . A circuit board structure with concave conductive cylinders, comprising:
 a conductive layer;   a plurality of conductive cylinders, formed on a surface of the conductive layer, and electrically connected to the conductive layer; and   a patterned dielectric layer, covering the surface of the conductive layer, wherein the tips of the conductive cylinders are exposed on a surface of the dielectric layer far away from the conductive layer, and the height of the conductive cylinders is relatively lower than the dielectric layer and the conductive cylinders sunk into the dielectric layer.   
   
   
       15 . The circuit board structure with concave conductive cylinders of  claim 14 , further comprises a solder material layer formed on the conductive cylinders to rise above the dielectric layer.