Inventor · disambiguated record
Shao-Chien Lee
Also filed as: LEE SHAO-CHIEN
19 granted patents·4 pending applications·17 citations·filing 2005–2023
89Inventor score
Top patents by PatentIndex Score
23 records- 0194US10939538B1Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Mar 2, 2021·5 cites·12 claims
- 0284US10056356B1Chip package circuit board moduleUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Aug 21, 2018·5 cites·8 claims
- 0374US12052815B2Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Jul 30, 2024·0 cites·15 claims
- 0472US10497847B2Structure and manufacturing method of heat dissipation substrate and package structure and method thereofUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Dec 3, 2019·2 cites·20 claims
- 0566US11600936B2Circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Mar 7, 2023·0 cites·8 claims
- 0665US11785707B2Circuit board and manufacturing method thereof and electronic deviceUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 10, 2023·0 cites·9 claims
- 0765US10159151B1Chip package circuit board moduleUNIMICRON TECHNOLOGY CORP·Filed 2017·Granted Dec 18, 2018·1 cites·6 claims
- 0865US7667144B2Circuit board and method of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2007·Granted Feb 23, 2010·3 cites·6 claims
- 0964US11991824B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 21, 2024·0 cites·3 claims
- 1059US12439529B2Plurality of build-up layers in a circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Oct 7, 2025·0 cites·11 claims
- 1159US11114782B2Method of manufacturing circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Sep 7, 2021·0 cites·4 claims
- 1259US7393720B2Method for fabricating electrical interconnect structureUNIMICRON TECHNOLOGY CORP·Filed 2005·Granted Jul 1, 2008·1 cites·11 claims
- 1354US10736215B1Multilayer circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Aug 4, 2020·0 cites·14 claims
- 1450US11737209B2Circuit board and manufacturing method thereof and electronic deviceUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Aug 22, 2023·0 cites·43 claims
- 1549US2009025210A1Circuit board structure with concave conductive cylinders and method for fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1648US11665832B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 1748US11540396B2Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Dec 27, 2022·0 cites·5 claims
- 1848US2009144972A1Circuit board and process for fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 1947US2022071000A1Circuit board structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 2046US2012124830A1Process for fabricating circuit boardCHENG DAVID C H·Filed 2012·Application pending·0 cites
- 2145US8091221B2Method of fabricating circuit boardLEE SHAO-CHIEN·Filed 2009·Granted Jan 10, 2012·0 cites·6 claims
- 2244US11641720B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 2, 2023·0 cites·16 claims
- 2341US8590147B2Method for fabricating circuit board structure with concave conductive cylindersLEE SHAO-CHIEN·Filed 2010·Granted Nov 26, 2013·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →