Semiconductor Device

Abstract

A semiconductor device comprises a first base layer of a first conductivity type; a plurality of second base layers of a second conductivity type, provided on a part of a first surface of the first base layer; trenches formed on each side of the second base layers, and formed to be deeper than the second base layers; an emitter layer formed along the trench on a surface of the second base layers; a collector layer of the second conductivity type, provided on a second surface of the first base layer opposite to the first surface; an insulating film formed on an inner wall of the trench, the insulating film being thicker on a bottom of the trench than on a side surface of the trench; a gate electrode formed within the trench, and isolated from the second base layers and the emitter layer by the insulating film; and a space section provided between the second base layers adjacent to each other, the space section being deeper than the second base layers and being electrically isolated from the emitter layer and the second base layers.

1 . A semiconductor device, comprising:
 a first base layer of a first conductivity type;   a plurality of second base layers of a second conductivity type, provided on a part of a first surface of the first base layer;   trenches formed on each side of the second base layers;   an emitter layer formed along the trench on a surface of the second base layers;   a collector layer of the second conductivity type, provided below a second surface of the first base layer opposite to the first surface;   an insulating film formed on an inner wall of the trench;   a gate electrode formed within the trench, and isolated from the second base layers and the emitter layer by the insulating film; and   bottom semiconductor layers respectively provided below bottoms of the trenches, the bottom semiconductor layers having the first conductivity type higher in impurity concentration than the first base layer, wherein   a width between the bottom semiconductor layers adjacent to each other is smaller than a width between the trenches adjacent to each other.   
     
     
         2 . The semiconductor device according to  claim 1 , wherein the bottom semiconductor layers are connected to the second base layers. 
     
     
         3 . The semiconductor device according to  claim 1 , wherein
 the insulating film is thicker on a bottom of the trench than on a side surface of the trench.   
     
     
         4 . The semiconductor device according to  claim 3 , wherein the bottom semiconductor layers are connected to the second base layers. 
     
     
         5 . The semiconductor device according to  claim 1 , wherein
 a space section is provided between the second base layers adjacent to each other, the space section including one of the trenches.   
     
     
         6 . The semiconductor device according to  claim 5 , wherein,
 the insulating film is formed to be thicker on a sidewall opposite to a second base layer-side sidewall than the insulating film on the second base layer-side sidewall.   
     
     
         7 . The semiconductor device according to  claim 5 , wherein a width between the second base layers adjacent to each other is larger than a width of the second base layer. 
     
     
         8 . The semiconductor device according to  claim 5 , wherein
 the first base layer appears on a surface of the space section.   
     
     
         9 . The semiconductor device according to  claim 5 , wherein
 the space section includes a space semiconductor layer provided between the trenches adjacent to each other.   
     
     
         10 . The semiconductor device according to  claim 9 , wherein
 the space semiconductor layer is connected to one of bottom semiconductor layers.   
     
     
         11 . The semiconductor device according to  claim 9 , wherein the space semiconductor layer are deeper than the second base layers. 
     
     
         12 . The semiconductor device according to  claim 5 , wherein the second base layers are connected to the bottom semiconductor layers.