Multi-Chip Stacked Package Structure

Abstract

A multi-chip stacked package structure, comprising: a lead-frame having a top surface a back surface, the inner leads comprising a plurality of first inner leads and a plurality of second inner leads in parallel; a first chip fixedly connected to the back surface of the lead-frame, and the first chip having an active surface and a plurality of first pads adjacent to the central area of the active surface; a plurality of first metal wires electrically connected the first inner leads and the second inner leads and the first pads on the active surface of the first chip; a second chip fixedly connected to the top surface of the lead-frame, and the second chip having an active surface and a plurality of second pads adjacent to the central area of the active surface; a pair of the spacers provided on the thermal fin of the lead-frame; a plurality of second metal wires electrically connected to the top surface of first inner leads and the second inner leads and the second pads on the active surface of the second chip; and a package body encapsulated the first chip, the plurality of metal wires the second chip, the plurality of pads, the first inner leads and the second inner leads and to expose the outer leads.

1 . A Multi-chip stacked package structure, comprising:
 a lead-frame having a top surface and a back surface, which composed of a plurality of inner leads and a plurality of outer leads, said inner leads comprising a plurality of first inner leads in parallel and a plurality of second inner leads in parallel, the end of said first inner leads and the end of second inner leads being arranged in rows facing each other at a distance, wherein two thermal fins adjacent to the central area of said first inner leads and said second inner leads;   a first chip fixedly connected to said back surface of said lead-frame, and said first chip having an active surface and a plurality of first pads adjacent to the central area of said active surface;   a plurality of first metal wires electrically connected said first inner leads and said second inner leads and said first pads on said active surface of said first chip;   a second chip fixedly connected to said top surface of said lead-frame, and said second chip having an active surace and a plurality of second pads adjacent to the central area of said active surface;   a pair of the spacers provided on said thermal fin of said lead-frame and contacted to a back surface correspond to said active surface of said second chip;   a plurality of second metal wires electrically connected to said top surface of first inner leads and said second inner leads and said second pads on said active surface of said second chip; and   a package body enscapsulated said first chip, said plurality of metal wires, said second chip, said plurality of pads, said first inner leads and said second inner leads and to expose said outer leads.   
     
     
         2 . The package structure according to  claim 1 , wherein said lead-frame further comprising a bus bar thereon. 
     
     
         3 . The package structure according to  claim 1 , wherein said width of said thermal fin is lager than said inner leads. 
     
     
         4 . The package structure according to  claim 3 , wherein said thermal fin with a fan-shaped is positioned on said outer leads. 
     
     
         5 . The package structure according to  claim 1 , wherein the height of said spacers is larger than the arc height of said plurality of first metal wires. 
     
     
         6 . The package structure according to  claim 1 , wherein each spacers is composed of stacking a plurality of solder balls. 
     
     
         7 . The package structure according to  claim 1 , wherein each spacers is composed of stacking a plurality of metal bumps. 
     
     
         8 . The package structure according to  claim 1 , wherein said second metal wires is formed by reverse wire bonding. 
     
     
         9 . The package structure according to  claim 1 , wherein said thermal fin is bended toward to said package body. 
     
     
         10 . The package structure according to  claim 9 , wherein the thermal fin and the outer leads are in the same horizontal surface. 
     
     
         11 . The package structure according to  claim 1 , wherein said thermal fin is hung in the air. 
     
     
         12 . A multi-chip stacked package structure, comprising:
 a lead-frame having an upper surface and a bottom, which composed of a plurality of inner leads and a plurality of outer leads, said inner leads comprising a plurality of first inner leads in parallel and a plurality of second inner leads in parallel, the end of said first inner leads and the end of second inner leads being arranged in rows facing each other at a distance, wherein two heat sink adjacent to the central area of said first inner leads and said second inner leads;   a first chip fixedly connected to said bottom surface of said lead-frame, and said first chip having an active surface and a plurality of first pads adjacent to the central area of said active surface;   a plurality of first metal wires electrically connected said first inner leads and said second inner leads and said first pads on said active surface of said first chip;   a pair of the spacers provided on said heat sink of said lead-frame and contacted to a back surface correspond to said active surface of said second chip;   a second chip fixedly connected to said upper surface of said lead-frame, and said second chip having an active surace and a plurality of second pads adjacent to the central area of said active surface, and a back surface having an adhesive layer thereon, so as to fixedly connect to said upper surface of said lead-frame via said adhesive layer, wherein said adhesive layer is covered said first metal wires and said pair of spacers, and said back surface of said second chip is contacted to said pair of spacers;   a plurality of second bonding wires electrically connected said upper surace of said first inner leads and said second inner leads to said second pads of said active surface of said second chip; and   a package body enscapsulated said first chip, said first metal wires, said second chip, said second metal wires, said first inner leads, said said second inner leads and to expose said outer leads.   
     
     
         13 . The package structure according to  claim 12 , wherein said lead-frame further comprising a bus bar thereon. 
     
     
         14 . The package structure according to  claim 12 , wherein the width of said thermal fin is larger than said inner leads. 
     
     
         15 . The package structure according to  claim 14 , wherein said thermal fin with a fan-shaped is positioned on said outer leads. 
     
     
         16 . The package structure according to  claim 12 , wherein the height of said spacers is larger than the arc height of said plurality of first metal wires. 
     
     
         17 . The package structure according to  claim 12 , wherein each spacers is composed of stacking a plurality of solder ball. 
     
     
         18 . The package structure according to  claim 12 , wherein said thermal fin is bended toward to said package body. 
     
     
         19 . The package structure according to  claim 18 , wherein said thermal fin and the outer leads are in the same horizontal surface. 
     
     
         20 . The package structure according to  claim 12 , wherein said thermal fin is hung in the air.