Assignee
SHEN GENG-SHIN
TW·8 granted patents·9 pending applications·10 citations·filing 2006–2012
Top patents by PatentIndex Score
17 records- 0178US8431478B2Solder cap bump in semiconductor package and method of manufacturing the sameSHEN GENG-SHIN·Filed 2011·Granted Apr 30, 2013·5 cites·12 claims
- 0267US8426255B2Chip package structure and method for manufacturing the sameSHEN GENG-SHIN·Filed 2011·Granted Apr 23, 2013·2 cites·21 claims
- 0362US8212347B2Stacked chip package structure with leadframe having bus barSHEN GENG-SHIN·Filed 2010·Granted Jul 3, 2012·1 cites·12 claims
- 0461US8207603B2Stacked chip package structure with leadframe having inner leads with transfer padSHEN GENG-SHIN·Filed 2010·Granted Jun 26, 2012·1 cites·8 claims
- 0561US8169061B2Stacked chip package structure with leadframe having bus barSHEN GENG-SHIN·Filed 2010·Granted May 1, 2012·1 cites·11 claims
- 0651US2010006997A1Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bus BarSHEN GENG-SHIN·Filed 2009·Application pending·0 cites
- 0747US2007215992A1Chip package and wafer treating method for making adhesive chipsSHEN GENG-SHIN·Filed 2006·Application pending·0 cites
- 0846US8712932B2Computer implemented apparatus for generating and filtering creative proposalSHEN GENG-SHIN·Filed 2012·Granted Apr 29, 2014·0 cites·11 claims
- 0946US2012313234A1Qfn package and manufacturing process thereofSHEN GENG-SHIN·Filed 2011·Application pending·0 cites
- 1046US2011163426A1Dice Rearrangement Package Structure Using Layout Process to Form a Compliant ConfigurationSHEN GENG-SHIN·Filed 2011·Application pending·0 cites
- 1146US2009230527A1Multi-chips package structure and the method thereofSHEN GENG-SHIN·Filed 2008·Application pending·0 cites
- 1245US2009072361A1Multi-Chip Stacked Package StructureSHEN GENG-SHIN·Filed 2008·Application pending·0 cites
- 1342US9023727B2Method of manufacturing semiconductor packagingSHEN GENG SHIN·Filed 2012·Granted May 5, 2015·0 cites·15 claims
- 1440US8058109B2Method for manufacturing a semiconductor structureSHEN GENG-SHIN·Filed 2010·Granted Nov 15, 2011·0 cites·12 claims
- 1538US2011298124A1Semiconductor StructureSHEN GENG-SHIN·Filed 2010·Application pending·0 cites
- 1635US2012018883A1Conductive structure for a semiconductor integrated circuitSHEN GENG-SHIN·Filed 2011·Application pending·0 cites
- 1734US2009006379A1Filtering method and system for the correlation between testing objects and patentsSHEN GENG-SHIN·Filed 2008·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →