Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bus Bar

Abstract

The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads arranged in rows facing each other and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips stacked together and provided on the die pad, the plurality of chips and the plurality of inner leads arranged in rows facing each other being electrically connected with each other; and an encapsulant provided to cover the chip-stacked structure and the leadframe; wherein the leadframe comprises at least a bus bar provided between the plurality of inner leads arranged in rows facing each other and the die pad, the bus bar being formed by multiple pieces.

1 . A leadframe structure with multi-piece bus bar, comprising a plurality of inner leads arranged in rows facing each other, a die pad provided between said plurality of inner leads, said die pad being vertically distant from said plurality of inner leads, and at least a bus bar provided between said plurality of inner leads and said die pad, the improvement of which being:
 said bus bar being formed by a plurality of metal fragments.   
     
     
         2 . The chip-stacked package structure as set forth in  claim 1 , wherein said bus bar and said die pad are vertically at the same height. 
     
     
         3 . The chip-stacked package structure as set forth in  claim 1 , wherein said bus bar and said plurality of inner leads are vertically at the same height. 
     
     
         4 . The chip-stacked package structure as set forth in  claim 1 , wherein said bus bar is vertically distant from said plurality of inner leads arranged in rows facing each other and said die pad. 
     
     
         5 . The chip-stacked package structure as set forth in  claim 1 , wherein said bus bar is arranged in a ring-shaped configuration. 
     
     
         6 . The chip-stacked package structure as set forth in  claim 1 , wherein said bus bar is arranged in a stripe-shaped configuration.