Inventor · disambiguated record
Wu-Chang Tu
Also filed as: TU WU-CHANG
11 granted patents·4 pending applications·66 citations·filing 2006–2010
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
15 records- 0191US7615853B2Chip-stacked package structure having leadframe with multi-piece bus barCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Nov 10, 2009·21 cites·14 claims
- 0288US7816771B2Stacked chip package structure with leadframe having inner leads with transfer padCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Oct 19, 2010·14 cites·3 claims
- 0385US7554197B2High frequency IC package and method for fabricating the sameCHIPMOS TECHNOLOGIES BERMUDA·Filed 2006·Granted Jun 30, 2009·14 cites·12 claims
- 0479US7786595B2Stacked chip package structure with leadframe having bus barCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Aug 31, 2010·7 cites·13 claims
- 0577US7576416B2Chip package having with asymmetric molding and turbulent plate downset designCHIPMOS TECHNOLOGIES INC·Filed 2006·Granted Aug 18, 2009·7 cites·18 claims
- 0662US8212347B2Stacked chip package structure with leadframe having bus barSHEN GENG-SHIN·Filed 2010·Granted Jul 3, 2012·1 cites·12 claims
- 0761US8207603B2Stacked chip package structure with leadframe having inner leads with transfer padSHEN GENG-SHIN·Filed 2010·Granted Jun 26, 2012·1 cites·8 claims
- 0861US8169061B2Stacked chip package structure with leadframe having bus barSHEN GENG-SHIN·Filed 2010·Granted May 1, 2012·1 cites·11 claims
- 0953US7834432B2Chip package having asymmetric moldingCHIPMOS TECHNOLOGIES INC·Filed 2009·Granted Nov 16, 2010·0 cites·15 claims
- 1051US2010006997A1Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bus BarSHEN GENG-SHIN·Filed 2009·Application pending·0 cites
- 1148US7781898B2IC package reducing wiring layers on substrate and its chip carrierCHIPMOS TECHNOLOGIES INC·Filed 2007·Granted Aug 24, 2010·0 cites·11 claims
- 1246US8026615B2IC package reducing wiring layers on substrate and its carrierCHIPMOS TECHNOLOGIES INC·Filed 2010·Granted Sep 27, 2011·0 cites·13 claims
- 1343US2008061411A1Chip-stacked package structure for lead frame having bus bars with transfer padsCHIPMOS TECHNOLOGIES BERMUDA·Filed 2007·Application pending·0 cites
- 1442US2007228581A1Universal chip package structureCHOU SHIH-WEN·Filed 2007·Application pending·0 cites
- 1540US2007080466A1Universal chip package structureCHOU SHIH-WEN·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →