Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration

Abstract

A dice rearrangement package structure is provided, which a dice having an active surface and a bottom surface, and a plurality of pads is disposed on the active surface; a package body is provided to cover the dices and the plurality of pads being exposed; one ends of plurality of metal traces is electrically connected to the each pads; a protection layer is provided to cover the active surface and the other ends of the exposed metal traces is electrically connected to the plurality of conductive elements, the characteristic in that the package body is a B-stage material.

1 . A dice rearrangement package structure, comprising:
 a dice having an active surface and a bottom surface, a plurality of pads being disposed on said active surface and at least one alignment mark being formed on said bottom surface of said dice;   an encapsulated body encapsulating five sides of said dice and exposing said plurality of pads on said active surface, wherein the material of said encapsulated body is B-stage material;   one ends of a plurality of fan-out metal traces electrically connecting said plurality of pads;   a protective layer encapsulating said active surface of said dice, said plurality of metal traces, and said encapsulated body, and exposing another ends of said plurality of metal traces; and   a plurality of connecting components electrically connecting another ends of said plurality of metal traces.   
     
     
         2 . The package structure according to  claim 1 , further comprising a substrate disposed on a reverse side of said encapsulated body. 
     
     
         3 . The package structure according to  claim 2 , wherein the material of said substrate is selected from the group consisting of: glass, wafer, and metal material. 
     
     
         4 . A dice rearrangement package structure, comprising:
 a dice having an active surface and a bottom surface, a plurality of pads being disposed on said active surface and at least one alignment mark being formed on said bottom surface of said dice;   an encapsulated body encapsulating five sides of said dice and exposing only said active surface, wherein the material of said encapsulated body is a layer of B-stage material;   a sensitive material encapsulating said active surface of said dice and exposing said plurality of pads;   one ends of a plurality of fan-out metal traces electrically connecting said plurality of pads;   a protective layer encapsulating said active surface of said dice, said plurality of metal traces, and said encapsulated body, and exposing another ends of said plurality of metal traces; and   a plurality of connecting components electrically connecting another ends of said plurality of metal traces.   
     
     
         5 . The package structure according to  claim 4 , further comprising a substrate disposed on a reverse side of said encapsulated body. 
     
     
         6 . The package structure according to  claim 5 , wherein the material of said substrate is selected from the group consisting of: glass, wafer, and metal material. 
     
     
         7 . A dice rearrangement package structure, comprising:
 a plurality of dices, each of said plurality of dices having an active surface and a bottom surface, a plurality of pads being disposed on said active surface and at least one alignment mark being formed on said bottom surface of said dice;   an encapsulated body, encapsulating five sides of each of said plurality of dice and exposing only said plurality of pads on said active surface of each of said plurality of dices, wherein the material of said encapsulated body is a layer of B-stage material;   a plurality of fan-out metal traces electrically connecting said plurality of pads;   a protective layer encapsulating said active surface of said plurality of dices, said plurality of metal traces, and said encapsulated body, and exposing another ends of said plurality of metal traces; and   a plurality of connecting components electrically connecting another ends of said plurality of metal traces.   
     
     
         8 . The package structure according to  claim 7 , wherein said plurality of dices are of same dimensions. 
     
     
         9 . The package structure according to  claim 8 , wherein said plurality of dices of same dimensions are light emitting devices (LED). 
     
     
         10 . The package structure according to  claim 8 , wherein said plurality of dices of same dimensions are dynamic random access memories (DRAM). 
     
     
         11 . The package structure according to  claim 7 , wherein said plurality of dices are of different dimensions. 
     
     
         12 . The package structure according to  claim 11 , wherein said plurality of dices of different dimensions are selected from the group consisting of: microprocessor means, memory means, and memory controller means. 
     
     
         13 . A dice rearrangement package structure, comprising:
 a plurality of dices, each of said plurality of dices having an active surface and a bottom surface, a plurality of pads being disposed on said active surface and at least an alignment mark being formed on said bottom surface of said dice;   an encapsulated body encapsulating five sides of each of said plurality of dices and exposing said plurality of pads on said active surface, wherein the material of encapsulated body is B-stage material;   a sensitive material encapsulating said active surface of said plurality of dice and exposing said plurality of pads;   one ends of a plurality of fan-out metal traces electrically connecting said plurality of pads;   a protective layer encapsulating said active surface of said plurality of dices, said plurality of metal traces, and said encapsulated boy, and exposing another ends of said plurality of metal traces; and   a plurality of connecting components electrically connecting another ends of said plurality of metal traces.   
     
     
         14 . The package structure according to  claim 13 , wherein said plurality of dices are of same dimensions. 
     
     
         15 . The package structure according to  claim 14 , wherein said plurality of dice of same dimensions are light emitting devices (LED). 
     
     
         16 . The package structure according to  claim 14 , wherein said plurality of dices of same dimensions are dynamic random access memories (DRAM). 
     
     
         17 . The package structure according to  claim 13 , wherein said plurality of dices are of different dimensions. 
     
     
         18 . The package structure according to  claim 17 , wherein said plurality of dices of different dimensions are selected from the group consisting of: microprocessor means, memory means, and memory controller means.