Electroplating system including interchangeable carriers for supporting and providing cathode potential to articles

Abstract

A processing system, electroplating cell, transport system, cathode contact subsystem and method of providing a cathode contact to the articles being transported within an electroplating cell. The processing system may include a loading station, pre-processing station, electroplating station, post-processing station, unloading station, and a transport system that transports the articles to the various stations. The electroplating cell comprises a container to support a plating fluid bath, and an anode electrode. In one embodiment, the cathode contact system provides a cathode contact to the articles by way of the transport system's electrically-conductive, conveyor structure. In another embodiment, the cathode contact system comprises an electrically-conductive moving conveyor structure adapted to make cathode contact to said articles and move substantially in synchronous with the articles. In yet another embodiment, the transport system comprises a plurality of multi-article carriers supported by a conveyor structure, and adapted to provide a cathode contact to the articles.

1 . An electroplating system, comprising:
 an electroplating cell including a container to support a plating fluid bath and an anode electrode situated within said container;   a transport system adapted to transport articles through said plating fluid bath, wherein said transport system comprises a plurality of carriers supported by a conveyor structure, and wherein said carriers are each adapted to support at least one of said articles, and further wherein said carriers are each adapted to provide a cathode contact to said at least one of said articles.   
   
   
       2 . The electroplating system of  claim 1 , wherein each of said carriers are adapted to support and provide a cathode contact to a plurality of articles. 
   
   
       3 . The electroplating system of  claim 2 , wherein said plurality of articles are arranged in a single row within said carrier. 
   
   
       4 . The electroplating system of  claim 2 , wherein said plurality of articles are arranged in a plurality of rows to form an array of articles. 
   
   
       5 . The electroplating system of  claim 2 , wherein each of said carriers comprises a base and a cover hinged upon said base, wherein said base is disposed on said conveyor structure, and further wherein said base is adapted to support said articles. 
   
   
       6 . The electroplating system of  claim 5 , wherein said base comprises a plurality of holes that register with corresponding holes of said conveyor structure, and further wherein said registered holes of said base and conveyor structure are adapted to receive said respective articles. 
   
   
       7 . The electroplating system of  claim 5 , wherein said cover and said base are configured such that said base is adapted to receive said articles when said cover is in a first position, and said cover is adapted to provide a cathode contact to said articles when said cover is in a second position different than said first position. 
   
   
       8 . The electroplating system of  claim 7 , wherein said cover comprises a plurality of spring-loaded fingers arranged to make electrical contact with respective articles when said cover is in said second position. 
   
   
       9 . The electroplating system of  claim 5 , wherein said cover comprises a cathode contact port to receive a cathode potential. 
   
   
       10 . The electroplating system of  claim 1 , wherein said conveyor structure comprises an endless metallic or non-metallic band. 
   
   
       11 . The electroplating system of  claim 1 , wherein said conveyor structure comprises a chain or cable. 
   
   
       12 . The electroplating system of  claim 1 , further comprising:
 a loading station adapted to load said at least one of said articles onto said respective carriers;   one or more pre-processing cells configured to perform one or more pre-processes on said articles prior to the articles undergoing one or more electroplating processes;   one or more post-processing cells configured to perform one or more post-processes on said articles after the articles have undergone the one or more electroplating processes; and   an unloading station adapted to unload said at least one of said articles from said respective carriers.   
   
   
       13 . A method of electroplating articles, comprising:
 placing a plurality of articles onto a base of carrier with a cover in a first position;   moving said cover of said carrier from said first position to a second position whereat said cover provides a cathode contact to said articles;   transporting said carrier into an electroplating cell, wherein said articles make contact with a plating fluid bath formed within said electroplating cell; and   energizing an anode electrode situated within said plating fluid bath to form a plating current through said articles.