Assignee
TECHNIC
US·49 granted patents·7 pending applications·1,126 citations·filing 1976–2025
Top patents by PatentIndex Score
56 records- 0193US6197182B1Apparatus and method for plating wafers, substrates and other articlesTECHNIC·Filed 1999·Granted Mar 6, 2001·110 cites·28 claims
- 0293US4585539AElectrolytic reactorTECHNIC·Filed 1983·Granted Apr 29, 1986·83 cites·61 claims
- 0393US4534843AApparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their likeTECHNIC·Filed 1983·Granted Aug 13, 1985·92 cites·16 claims
- 0492US4246077ANon-cyanide bright silver electroplating bath therefor, silver compounds and method of making silver compoundsTECHNIC·Filed 1978·Granted Jan 20, 1981·48 cites·30 claims
- 0591US6251238B1Anode having separately excitable sections to compensate for non-uniform plating deposition across the surface of a wafer due to seed layer resistanceTECHNIC·Filed 1999·Granted Jun 26, 2001·76 cites·39 claims
- 0691US4126524ASilver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloysTECHNIC·Filed 1976·Granted Nov 21, 1978·48 cites·41 claims
- 0790US4673472AMethod and electroplating solution for deposition of palladium or alloys thereofTECHNIC·Filed 1986·Granted Jun 16, 1987·49 cites·22 claims
- 0889US4406755ABright palladium electrodepositionTECHNIC·Filed 1982·Granted Sep 27, 1983·35 cites·12 claims
- 0986US6860981B2Minimizing whisker growth in tin electrodepositsTECHNIC·Filed 2002·Granted Mar 1, 2005·34 cites·30 claims
- 1086US4278514ABright palladium electrodeposition solutionTECHNIC·Filed 1980·Granted Jul 14, 1981·28 cites·8 claims
- 1185US5277790ANon-cyanide electroplating solution for gold or alloys thereofTECHNIC·Filed 1992·Granted Jan 11, 1994·38 cites·27 claims
- 1285US4049508ATin-nickel platingTECHNIC·Filed 1976·Granted Sep 20, 1977·26 cites·1 claims
- 1383US6524463B2Method of processing wafers and other planar articles within a processing cellTECHNIC·Filed 2001·Granted Feb 25, 2003·30 cites·17 claims
- 1483US6296753B1Apparatus and method for plating wafers, substrates and other articlesTECHNIC·Filed 2000·Granted Oct 2, 2001·17 cites·19 claims
- 1579US7270733B2Method and apparatus for real time monitoring of industrial electrolytesTECHNIC·Filed 2003·Granted Sep 18, 2007·29 cites·54 claims
- 1678US5110423ABath for electroplating bright tin or tin-lead alloys and method thereofTECHNIC·Filed 1990·Granted May 5, 1992·33 cites·48 claims
- 1777US6299751B1Apparatus and method for plating wafers, substrates and other articlesTECHNIC·Filed 2000·Granted Oct 9, 2001·11 cites·16 claims
- 1874US6183619B1Metal alloy sulfonic acid electroplating bathsTECHNIC·Filed 1999·Granted Feb 6, 2001·29 cites·16 claims
- 1973US7270734B1Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplatingTECHNIC·Filed 2004·Granted Sep 18, 2007·13 cites·16 claims
- 2073US5296128AGallic acid as a combination antioxidant, grain refiner, selective precipitant, and selective coordination ligand, in plating formulationsTECHNIC·Filed 1993·Granted Mar 22, 1994·26 cites·21 claims
- 2172US2026086067A1System for the Simultaneous Monitoring of Constituents of an Electroplating BathTECHNIC·Filed 2025·Application pending·0 cites
- 2271US7124120B2Method and apparatus for real time monitoring of electroplating bath performance and early fault detectionTECHNIC·Filed 2003·Granted Oct 17, 2006·14 cites·33 claims
- 2371US6562220B2Metal alloy sulfate electroplating bathsTECHNIC·Filed 2001·Granted May 13, 2003·7 cites·31 claims
- 2469US4923576AAdditives for electroplating compositions and methods for their useTECHNIC·Filed 1988·Granted May 8, 1990·17 cites·20 claims
- 2568US6558750B2Method of processing and plating planar articlesTECHNIC·Filed 2001·Granted May 6, 2003·12 cites·26 claims
- 2668US2009090633A1Electroplating system with movable support structure providing cathode potentialTECHNIC·Filed 2008·Application pending·0 cites
- 2768US2009090632A1Electroplating system including interchangeable carriers for supporting and providing cathode potential to articlesTECHNIC·Filed 2008·Application pending·0 cites
- 2867US5755954AMethod of monitoring constituents in electroless plating bathsTECHNIC·Filed 1996·Granted May 26, 1998·35 cites·14 claims
- 2966US7208073B1Media for use in plating electronic componentsTECHNIC·Filed 2003·Granted Apr 24, 2007·5 cites·18 claims
- 3066US6274024B1Apparatus and method for plating wafers, substrates and other articlesTECHNIC·Filed 2000·Granted Aug 14, 2001·5 cites·17 claims
- 3163US4508611AApparatus for electroplating and chemically treating the contact elements of encapsulated electronic components and like devicesTECHNIC·Filed 1983·Granted Apr 2, 1985·13 cites·15 claims
- 3263US2024133074A1System for the Simultaneous Monitoring of Constituents of an Electroplating BathTECHNIC·Filed 2023·Application pending·0 cites
- 3362US6277260B1Apparatus and method for plating wafers, substrates and other articlesTECHNIC·Filed 2000·Granted Aug 21, 2001·4 cites·10 claims
- 3462US5282953APolyoxyalklene compounds terminated with ketone groups for use as surfactants in alkanesulfonic acid based solder plating bathsTECHNIC·Filed 1993·Granted Feb 1, 1994·16 cites·25 claims
- 3561US6132583AShielding method and apparatus for use in electroplating processTECHNIC·Filed 1997·Granted Oct 17, 2000·22 cites·17 claims
- 3661US4186064AMethod and electrolyte for electrodeposition of bright gold and gold alloysTECHNIC·Filed 1978·Granted Jan 29, 1980·11 cites·16 claims
- 3759US6274023B1Apparatus and method for electroplating wafers, substrates and other articlesTECHNIC·Filed 2000·Granted Aug 14, 2001·3 cites·15 claims
- 3858US6982030B2Reduction of surface oxidation during electroplatingTECHNIC·Filed 2002·Granted Jan 3, 2006·3 cites·16 claims
- 3957US4981564AAdditives for electroplating compositions and methods for their useTECHNIC·Filed 1990·Granted Jan 1, 1991·21 cites·19 claims
- 4056US6251253B1Metal alloy sulfate electroplating bathsTECHNIC·Filed 1999·Granted Jun 26, 2001·12 cites·16 claims
- 4155US6287443B1Apparatus and method for electroplating wafers, substrates and other articlesTECHNIC·Filed 2000·Granted Sep 11, 2001·2 cites·17 claims
- 4254US5130168AElectroless gold plating bath and method of using sameTECHNIC·Filed 1989·Granted Jul 14, 1992·16 cites·16 claims
- 4353US2006016692A1Reduction of surface oxidation during electroplatingTECHNIC·Filed 2005·Application pending·0 cites
- 4452US5935306AElectroless gold plating bathTECHNIC·Filed 1998·Granted Aug 10, 1999·19 cites·30 claims
- 4552US5338343ACatalytic electroless gold plating bathsTECHNIC·Filed 1993·Granted Aug 16, 1994·16 cites·12 claims
- 4651US6419805B1Apparatus for plating wafers, substrates and other articlesTECHNIC·Filed 2000·Granted Jul 16, 2002·1 cites·22 claims
- 4751US6267862B1Apparatus and method for plating wafers, substrates and other articlesTECHNIC·Filed 2000·Granted Jul 31, 2001·1 cites·7 claims
- 4851US6264806B1Plating fluid replenishment system and methodTECHNIC·Filed 1999·Granted Jul 24, 2001·13 cites·8 claims
- 4947US7431817B2Electroplating solution for gold-tin eutectic alloyTECHNIC·Filed 2005·Granted Oct 7, 2008·0 cites·22 claims
- 5047US7279086B2Electroplating solution for alloys of gold with tinTECHNIC·Filed 2004·Granted Oct 9, 2007·0 cites·19 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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