Electroplating system with movable support structure providing cathode potential

Abstract

A processing system, electroplating cell, transport system, cathode contact subsystem and method of providing a cathode contact to the articles being transported within an electroplating cell. The processing system may include a loading station, pre-processing station, electroplating station, post-processing station, unloading station, and a transport system that transports the articles to the various stations. The electroplating cell comprises a container to support a plating fluid bath, and an anode electrode. In one embodiment, the cathode contact system provides a cathode contact to the articles by way of the transport system's electrically-conductive, conveyor structure. In another embodiment, the cathode contact system comprises an electrically-conductive moving conveyor structure adapted to make cathode contact to said articles and move substantially in synchronous with the articles. In yet another embodiment, the transport system comprises a plurality of multi-article carriers supported by a conveyor structure, and adapted to provide a cathode contact to the articles.

1 . An electroplating system, comprising:
 an electroplating cell including a container to support a plating fluid bath and an anode electrode situated within said container;   a transport system adapted to transport articles through said plating fluid bath, wherein said transport system comprises an electrically conductive, movable support structure to support said articles; and   a cathode contact system adapted to provide a cathode potential to said articles by way of said electrically conductive, movable support structure.   
   
   
       2 . The electroplating system of  claim 1 , wherein said cathode contact system comprises a contact member adapted to slide against said electrically-conductive, movable support structure. 
   
   
       3 . The electroplating system of  claim 1 , wherein said cathode contact system comprises a contact member that is rotationally coupled to said electrically-conductive, movable support structure. 
   
   
       4 . The electroplating system of  claim 3 , wherein said contact member comprises a first electrically-conductive wheel rotationally coupled to said electrically-conductive, movable support structure; and wherein said cathode contact system further comprises:
 a second electrically-conductive wheel rotationally coupled to said first electrically-conductive wheel; and   a brush in electrical contact with said second electrically-conductive wheel, wherein said brush is electrically coupled to a source of said cathode potential.   
   
   
       5 . The electroplating system of  claim 1 , wherein said electrically-conductive, movable support structure comprises a belt, a chain, or a cable. 
   
   
       6 . The electroplating system of  claim 1 , further comprising a movable preload mechanism to apply a continuous force to the articles against the electrically conductive, movable support structure to ensure a positive cathode contact to said articles. 
   
   
       7 . The electroplating system of  claim 1 , further comprising a plurality of insert-carriers supported on said electrically-conductive, movable support structure, wherein said insert-carriers are adapted to respectively support said articles. 
   
   
       8 . The electroplating system of  claim 1 , further comprising:
 a loading station adapted to load said articles onto said electrically-conductive, movable support structure;   one or more pre-processing cells configured to perform one or more pre-processes on said articles prior to the articles undergoing one or more electroplating processes;   one or more post-processing cells configured to perform one or more post-processes on said articles after the articles have undergone the one or more electroplating processes; and   an unloading station adapted to unload said articles from said electrically-conductive, movable support structure.   
   
   
       9 . A method of electroplating articles, comprising:
 transporting said one or more articles into an electroplating cell by an electrically conductive, movable support structure, wherein said articles make contact with a plating fluid bath formed within said electroplating cell;   providing a cathode potential to said articles by way of said electrically conductive, movable support structure; and   energizing an anode electrode situated within said plating fluid bath to form a plating current through said articles.