US2009117733A1PendingUtilityA1

Protection of seedlayer for electroplating

56
Individually held — no corporate assignee on recordPriority: Jun 28, 2002Filed: Dec 24, 2008Published: May 7, 2009
Est. expiryJun 28, 2022(expired)· nominal 20-yr term from priority
Inventors:Valery M. DubinPeter K. Moon
H10P 14/47H10W 20/425H10W 20/056H10W 20/043H10W 20/033
56
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Claims

Abstract

The present invention includes a method of providing a substrate; sequentially forming a seed layer over the substrate and forming a protection layer over the seed layer; and sequentially removing the protection layer and forming a conductor over the seed layer. The present invention further includes a structure having a substrate, the substrate having a device; an insulator disposed over the substrate, the insulator having an opening, the opening disposed over the device; a barrier layer disposed over the opening; a seed layer disposed over the barrier layer; and a protection layer disposed over the seed layer.

Claims

exact text as granted — not AI-modified
1 . A method comprising:
 providing a substrate, said substrate having a device;   forming an insulator over said substrate;   forming an opening in said insulator over said device;   forming a barrier layer over said opening and said insulator;   sequentially forming a seed layer over said barrier layer and forming a protection layer over said seed layer; and   sequentially removing said protection layer and forming a conductor over said seed layer.   
   
   
       2 . The method of  claim 1  wherein said barrier layer is formed from a bilayer. 
   
   
       3 . The method of  claim 1  wherein said seedlayer is formed from a different material than said conductor. 
   
   
       4 . The method of  claim 1  wherein said protection layer is removable in water. 
   
   
       5 . The method of  claim 1  wherein said protection layer is removable in an acidic aqueous solution. 
   
   
       6 . The method of  claim 1  wherein said protection layer is removable in an electroplating bath. 
   
   
       7 . The method of  claim 1  wherein said protection layer is soluble in a solvent. 
   
   
       8 . The method of  claim 1  wherein said protection layer is removable by exposure to heat. 
   
   
       9 . The method of  claim 1  wherein said protection layer is removable by exposure to radiation. 
   
   
       10 . The method of  claim 1  wherein said protection layer comprises a single molecular layer. 
   
   
       11 . The method of  claim 1  wherein said protection layer comprises a single atomic layer. 
   
   
       12 . The method of  claim 1  wherein said protection layer comprises a monolayer. 
   
   
       13 . The method of  claim 1  wherein said protection layer comprises an Amine functional group that attaches to said seedlayer. 
   
   
       14 . The method of  claim 1  wherein said protection layer comprises a polymer with a molecular weight of about 100 or greater. 
   
   
       15 . The method of  claim 1  wherein said protection layer comprises a water-soluble polymer. 
   
   
       16 . The method of  claim 1  wherein said water-soluble polymer comprises an alcohol or a glycol that is soluble in water. 
   
   
       17 . A method comprising:
 providing a substrate, said substrate having a device;   forming an insulator over said substrate;   forming an opening in said insulator over said device;   forming a barrier layer with atomic layer deposition over said opening and said insulator;   sequentially forming a seed layer over said barrier layer and forming a protection layer over said seed layer; and   sequentially removing said protection layer and forming a conductor over said seed layer.   
   
   
       18 . The method of  claim 17  wherein said protection layer is deposited from a vapor phase. 
   
   
       19 . The method of  claim 17  wherein said protection layer is deposited from a liquid phase. 
   
   
       20 . The method of  claim 17  wherein said protection layer is removable by exposure to heat.

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