Inventor · disambiguated record
Peter K. Moon
Also filed as: MOON PETER · MOON PETER K
31 granted patents·5 pending applications·1,168 citations·filing 1995–2016
97Inventor score
Top patents by PatentIndex Score
36 records- 0197US5719085AShallow trench isolation techniqueINTEL CORP·Filed 1995·Granted Feb 17, 1998·513 cites·19 claims
- 0294US7018918B2Method of forming a selectively converted inter-layer dielectric using a porogen materialINTEL CORP·Filed 2003·Granted Mar 28, 2006·76 cites·13 claims
- 0392US6977435B2Thick metal layer integrated process flow to improve power delivery and mechanical bufferingINTEL CORP·Filed 2003·Granted Dec 20, 2005·82 cites·28 claims
- 0492US5827769AMethod for fabricating a transistor with increased hot carrier resistance by nitridizing and annealing the sidewall oxide of the gate electrodeINTEL CORP·Filed 1996·Granted Oct 27, 1998·130 cites·13 claims
- 0590US7586196B2Apparatus for an improved air gap interconnect structureINTEL CORP·Filed 2007·Granted Sep 8, 2009·16 cites·25 claims
- 0690US6943121B2Selectively converted inter-layer dielectricINTEL CORP·Filed 2002·Granted Sep 13, 2005·43 cites·12 claims
- 0784US8058710B2Interconnects having sealing structures to enable selective metal capping layersHE JUN·Filed 2008·Granted Nov 15, 2011·6 cites·9 claims
- 0884US7402519B2Interconnects having sealing structures to enable selective metal capping layersINTEL CORP·Filed 2005·Granted Jul 22, 2008·6 cites·6 claims
- 0984US7279423B2Forming a copper diffusion barrierINTEL CORP·Filed 2002·Granted Oct 9, 2007·26 cites·10 claims
- 1084US6703069B1Under bump metallurgy for lead-tin bump over copper padINTEL CORP·Filed 2002·Granted Mar 9, 2004·33 cites·6 claims
- 1181US6908829B2Method of forming an air gap intermetal layer dielectric (ILD) by utilizing a dielectric material to bridge underlying metal linesINTEL CORP·Filed 2002·Granted Jun 21, 2005·34 cites·22 claims
- 1277US5985735ATrench isolation process using nitrogen preconditioning to reduce crystal defectsINTEL CORP·Filed 1995·Granted Nov 16, 1999·49 cites·15 claims
- 1376US6878465B2Under bump metallurgy for Lead-Tin bump over copper padINTEL CORP·Filed 2003·Granted Apr 12, 2005·19 cites·9 claims
- 1472US9437545B2Interconnects having sealing structures to enable selective metal capping layersINTEL CORP·Filed 2014·Granted Sep 6, 2016·1 cites·6 claims
- 1571US6833320B2Removing sacrificial material by thermal decompositionINTEL CORP·Filed 2002·Granted Dec 21, 2004·14 cites·15 claims
- 1668US7239019B2Selectively converted inter-layer dielectricINTEL CORP·Filed 2005·Granted Jul 3, 2007·2 cites·14 claims
- 1766US7304388B2Method and apparatus for an improved air gap interconnect structureINTEL CORP·Filed 2003·Granted Dec 4, 2007·10 cites·12 claims
- 1866US6649515B2Photoimageable material patterning techniques useful in fabricating conductive lines in circuit structuresINTEL CORP·Filed 1998·Granted Nov 18, 2003·35 cites·14 claims
- 1965US6118168ATrench isolation process using nitrogen preconditioning to reduce crystal defectsINTEL CORP·Filed 1997·Granted Sep 12, 2000·29 cites·4 claims
- 2061US7060617B2Method of protecting a seed layer for electroplatingINTEL CORP·Filed 2002·Granted Jun 13, 2006·5 cites·13 claims
- 2159US9984922B2Interconnects having sealing structures to enable selective metal capping layersINTEL CORP·Filed 2016·Granted May 29, 2018·0 cites·16 claims
- 2259US5911111APolysilicon polish for patterning improvementINTEL CORP·Filed 1997·Granted Jun 8, 1999·18 cites·12 claims
- 2357US8227335B2Forming a copper diffusion barrierJOHNSTON STEVEN W·Filed 2007·Granted Jul 24, 2012·1 cites·5 claims
- 2456US2009117733A1Protection of seedlayer for electroplatingDUBIN VALERY M·Filed 2008·Application pending·0 cites
- 2555US7223694B2Method for improving selectivity of electroless metal depositionINTEL CORP·Filed 2003·Granted May 29, 2007·4 cites·14 claims
- 2654US8928125B2Interconnects having sealing structures to enable selective metal capping layersHE JUN·Filed 2011·Granted Jan 6, 2015·0 cites·18 claims
- 2753US7629268B2Method for an improved air gap interconnect structureINTEL CORP·Filed 2007·Granted Dec 8, 2009·0 cites·14 claims
- 2853US7525196B2Protection of seedlayer for electroplatingINTEL CORP·Filed 2006·Granted Apr 28, 2009·0 cites·14 claims
- 2953US7078754B2Methods and apparatuses for producing a polymer memory deviceINTEL CORP·Filed 2004·Granted Jul 18, 2006·4 cites·11 claims
- 3049US7326981B2Methods and apparatuses for producing a polymer memory deviceINTEL CORP·Filed 2006·Granted Feb 5, 2008·0 cites·6 claims
- 3147US6900063B2Methods and apparatuses for producing a polymer memory deviceINTEL CORP·Filed 2003·Granted May 31, 2005·2 cites·11 claims
- 3246US2006076678A1Thick metal layer integrated process flow to improve power delivery and mechanical bufferingKIM SARAH E·Filed 2005·Application pending·0 cites
- 3345US6707120B1Field effect transistorINTEL CORP·Filed 1998·Granted Mar 16, 2004·10 cites·3 claims
- 3441US2005042874A1Removing sacrificial material by thermal decompositionFiled 2004·Application pending·0 cites
- 3539US2004248403A1Method for forming electroless metal low resistivity interconnectsFiled 2003·Application pending·0 cites
- 3638US2005146048A1Damascene interconnect structuresFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →