Apparatus for packaging a tape substrate

Abstract

An apparatus for packaging a tape substrate is provided. The apparatus includes a plurality of robotic arms, a plurality of clamping elements attached to the robotic arms, a memory having a program stored therein, and a control module coupled to the memory to execute the program to perform a packaging process. The packaging process includes clamping a plurality of segments of a tape substrate to the clamping elements, encapsulating a first chip to a first side of a tape substrate to form a first capsule in a first segment, and securing a second segment of the tape substrate adjacent the first segment to a second clamping element. The packing process also includes moving the robotic arms relative to one another to stack the second segment over the first capsule. The first clamping element and second clamping element move independently of each other.

1 . A device packaging apparatus comprising:
 a plurality of robotic arms;   a plurality of clamping elements attached to the robotic arms;   a memory having a program stored therein; and   a control module coupled to the memory to execute the program to perform a packaging process comprising:
 clamping a plurality of segments of a tape substrate to the clamping elements, encapsulating a first chip to a first side of a tape substrate to form a first capsule in a first segment; 
 securing a second segment of the tape substrate adjacent the first segment to a second clamping element; and 
 moving the robotic arms relative to one another to stack the second segment over the first capsule, wherein the first clamping element and second clamping element are moved independently of each other. 
   
   
   
       2 . The device packaging apparatus of  claim 1 , wherein the clamping elements comprise vacuum chucks. 
   
   
       3 . The device packaging apparatus of  claim 1 , wherein each robotic arm moves independently with respect to one another. 
   
   
       4 . The device packaging apparatus of  claim 1  further comprising at least one adhesive applicator to apply adhesive between the second segment and the first capsule. 
   
   
       5 . The device packaging apparatus of  claim 4 , wherein the adhesive applicator comprises an adhesive tape applicator. 
   
   
       6 . The device packaging apparatus of  claim 4 , wherein the adhesive applicator comprises a fluid adhesive applicator. 
   
   
       7 . A device packaging apparatus comprising:
 a first robotic arm and a second robotic arm;   a first clamping element and a second clamping element attached to the first and second robotic arms, respectively;   a memory having a program stored therein; and   a control module coupled to the memory to execute the program to perform packaging operations comprising:   securing a first segment of a tape substrate to a first clamping element;   securing a second segment of the tape substrate adjacent the first segment to the second clamping element;   automatically moving at least one of the first clamping element and the second clamping element, relative to one another, in at least one direction while folding the tape substrate to stack the second segment over the first segment.   
   
   
       8 . The apparatus of  claim 7 , wherein moving at least one of the first clamp element and the second clamping element comprises:
 moving the first clamping element horizontally in one direction; and   simultaneously folding the tape substrate to stack the second segment of the tape substrate over the first segment, maintaining an amount of slack in the tape substrate while the tape substrate is folded.   
   
   
       9 . The apparatus of  claim 8 , wherein folding the tape substrate comprises:
 rotating the second clamping element for approximately 180 degrees; and   moving the second clamping element to place the second segment of the tape substrate over the first segment.   
   
   
       10 . The apparatus of  claim 7  wherein:
 securing the first segment of the tape substrate includes placing the second side of the tape substrate in the first segment over the first clamping element; and   securing the second segment of the tape substrate includes placing the second side of the tape substrate in the second segment over the second clamping element, wherein the first and second clamping elements each comprise a vacuum chuck.   
   
   
       11 . The apparatus of  claim 7  further comprising:
 an adhesive applicator to apply a first adhesive over at least one of the first segment and the second segment of the tape substrate before moving at least one of the first segment and the second segment to stack the second segment over the first segment.   
   
   
       12 . The apparatus of  claim 11 , further comprising:
 a heating element to heat the first adhesive.   
   
   
       13 . The apparatus of  claim 11 , further comprising:
 a source of electromagnetic radiation to irradiate the first adhesive with an electromagnetic radiation.   
   
   
       14 . The apparatus of  claim 1  further comprising:
 a cooling element to cool the first adhesive.   
   
   
       15 . The apparatus of  claim 7  further comprising:
 a third clamping element, the third clamping element moving independently relative to the first and second clamping elements;   
   
   
       16 . The apparatus of  claim 15 , further comprising:
 a fourth clamping element, the fourth clamping element moving independently relative to the first, second, and third clamping elements.