US2009146101A1PendingUtilityA1

Etchant for metal alloy having hafnium and molybdenum

Assignee: NANYA TECHNOLOGY CORPPriority: Dec 7, 2007Filed: Apr 15, 2008Published: Jun 11, 2009
Est. expiryDec 7, 2027(~1.4 yrs left)· nominal 20-yr term from priority
H10P 50/667C23F 1/26
51
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Claims

Abstract

An etchant for etching a metal alloy having hafnium and molybdenum includes 20 to 80 percent by weight of nitric acid, 1 to 49 percent by weight of hydrofluoric acid, 1 to 96 percent by weight of sulfuric acid, and 1 to 30 percent by weight of water, based on the total weight of the etchant.

Claims

exact text as granted — not AI-modified
1 . An etchant used for etching a metal alloy material having hafnium and molybdenum, the etchant comprising at least nitric acid, hydrofluoric acid and sulfuric acid. 
   
   
       2 . The etchant as claimed in  claim 1 , wherein the etchant comprises 20-80 percent by weight of nitric acid. 
   
   
       3 . The etchant as claimed in  claim 2 , wherein the etchant comprises 1-49 percent by weight of hydrofluoric acid. 
   
   
       4 . The etchant as claimed in  claim 3 , wherein the etchant comprises 1-96 percent by weight of sulfuric acid. 
   
   
       5 . The etchant as claimed in  claim 4 , wherein the metal alloy material having hafnium and molybdenum is hafnium-molybdenum alloy nitride. 
   
   
       6 . The etchant as claimed in  claim 1 , wherein the metal alloy material having hafnium and molybdenum is hafnium-molybdenum alloy nitride. 
   
   
       7 . An etchant used for etching a hafnium-molybdenum alloy nitride, at least comprising:
 nitric acid, 20-80 percent by weight;   hydrofluoric acid, 1-49 percent by weight;   sulfuric acid, 1-96 percent by weight; and   water, 1-30 percent by weight.

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