Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same

Abstract

A substrate for mounting a device comprises: an insulating resin layer; a plurality of projected electrodes that are connected electrically to a wiring layer provided on one major surface of the insulating resin layer, and that project toward the insulating resin layer from the wiring layer; and a counter electrode provided at a position corresponding to each of the plurality of projected electrodes on the other major surface of the insulating resin layer. Among the projected electrodes, a projected length of part of the projected electrodes is smaller than that of the other projected electrodes; and the projected electrode and the counter electrode corresponding thereto are capacitively-coupled, and the projected electrode and the counter electrode are connected electrically.

1 . A substrate for mounting a device comprising:
 an insulating resin layer;   a wiring layer provided on one major surface of the insulating resin layer;   a projected electrode that is connected to the wiring layer electrically and that projects toward the insulating resin layer from the wiring layer; and   a metal member at least part of which is embedded in the insulating resin layer, wherein an embedded depth of the metal member is shallower than a projected length of the projected electrode.   
     
     
         2 . The substrate for mounting a device according to  claim 1 , wherein the metal member has a top face, and the top face is embedded in the insulating resin layer from the one major surface of the insulating resin layer, in the state where the top face is parallel to the other major surface of the insulating resin layer. 
     
     
         3 . The substrate for mounting a device according to  claim 2 , wherein the top face is positioned inside the insulating resin layer. 
     
     
         4 . The substrate for mounting a device according to claim  2 , wherein the metal member is provided between a pair of projected electrodes. 
     
     
         5 . The substrate for mounting a device according to  claim 2 , wherein the projected electrode is provided at the periphery of the insulating resin layer in planar view, and wherein the metal member is provided at the center of the insulating resin layer in planar view. 
     
     
         6 . The substrate for mounting a device according to  claim 2 , wherein the metal member is made of the same material as that of the projected electrode. 
     
     
         7 . The substrate for mounting a device according to  claim 1 , wherein the metal member has a top face parallel to the other major surface of the insulating resin layer, and is connected to the wiring layer electrically; and wherein the substrate for mounting a device comprises a counter electrode that is provided at a position corresponding to the projected electrode and the metal member on the other major surface of the insulating resin layer, and that has a counterface facing the top face of the projected electrode and the top face of the metal member; and wherein the metal member and the counter electrode corresponding thereto are capacitively-coupled, and the projected electrode and the counter electrode corresponding thereto are connected electrically. 
     
     
         8 . The substrate for mounting a device according to  claim 7 , wherein the substrate for mounting a device has a dielectric film layer having a dielectric constant larger than that of the insulating resin layer, between the top face of the metal member and the counterface of the counter electrode corresponding to the metal member. 
     
     
         9 . The substrate for mounting a device according to  claim 7 , wherein the substrate for mounting a device comprises other wiring layer provided on the other major surface of the insulating resin layer, and wherein the counter electrode is part of the other wiring layer. 
     
     
         10 . The substrate for mounting a device according to  claim 7 , wherein the metal member is made of the same material as that of the projected electrode. 
     
     
         11 . A semiconductor module comprising:
 the substrate for mounting a device according to  claim 2 ; and   a semiconductor device provided with a device electrode and mounted on the substrate for mounting a device.   
     
     
         12 . A portable apparatus in which the semiconductor module according to  claim 11  is mounted.