Inventor · disambiguated record
Mayumi Nakasato
Also filed as: NAKASATO MAYUMI
26 granted patents·11 pending applications·101 citations·filing 2001–2016
95Inventor score
Files withSANYO ELECTRIC CO19NAKASATO MAYUMI5SAITOU KOUICHI3SEMICONDUCTOR TECH ACAD RES CT3USUI RYOSUKE2
Top patents by PatentIndex Score
37 records- 0195US7915737B2Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile deviceSANYO ELECTRIC CO·Filed 2007·Granted Mar 29, 2011·40 cites·5 claims
- 0284US8378229B2Circuit board and method for manufacturing semiconductor modules and circuit boardsSANYO ELECTRIC CO·Filed 2010·Granted Feb 19, 2013·7 cites·11 claims
- 0379US9024446B2Element mounting substrate and semiconductor moduleUSUI RYOSUKE·Filed 2010·Granted May 5, 2015·6 cites·6 claims
- 0478US7759581B2Circuit board and method for manufacturing semiconductor modules and circuit boardsSANYO ELECTRIC CO·Filed 2007·Granted Jul 20, 2010·6 cites·15 claims
- 0577US9307630B2Device mounting board, cell, and battery moduleSANYO ELECTRIC CO·Filed 2013·Granted Apr 5, 2016·2 cites·5 claims
- 0676US10186738B2Cell module and manufacturing method for cell moduleSANYO ELECTRIC CO·Filed 2016·Granted Jan 22, 2019·1 cites·6 claims
- 0776US8258620B2Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor moduleNAKASATO MAYUMI·Filed 2008·Granted Sep 4, 2012·6 cites·5 claims
- 0875US9431686B2Cell module and manufacturing method for cell moduleOMURA TETSUJI·Filed 2012·Granted Aug 30, 2016·3 cites·8 claims
- 0973US8097946B2Device mounting board, semiconductor module, and mobile deviceSAITOU KOUICHI·Filed 2008·Granted Jan 17, 2012·5 cites·9 claims
- 1072US7969005B2Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method thereforSANYO ELECTRIC CO·Filed 2008·Granted Jun 28, 2011·4 cites·2 claims
- 1170US7745938B2Circuit device, a method for manufacturing a circuit device, and a semiconductor moduleSANYO ELECTRIC CO·Filed 2008·Granted Jun 29, 2010·4 cites·11 claims
- 1268US8373281B2Semiconductor module and portable apparatus provided with semiconductor moduleSANYO ELECTRIC CO·Filed 2009·Granted Feb 12, 2013·3 cites·13 claims
- 1365US7851921B2Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting boardSANYO ELECTRIC CO·Filed 2007·Granted Dec 14, 2010·2 cites·9 claims
- 1457US8592257B2Method for manufacturing semiconductor modulesNAKASATO MAYUMI·Filed 2012·Granted Nov 26, 2013·1 cites·2 claims
- 1557US8283568B2Device mounting board, and semiconductor module and manufacturing method thereforNAKASATO MAYUMI·Filed 2009·Granted Oct 9, 2012·1 cites·5 claims
- 1657US7897958B2Phase-change memory device, phase-change channel transistor, and memory cell arraySEMICONDUCTOR TECH ACAD RES CT·Filed 2007·Granted Mar 1, 2011·1 cites·5 claims
- 1757US7781753B2Multi-value recording phase-change memory device, multi-value recording phase-change channel transistor, and memory cell arraySEMICONDUCTOR TECH ACAD RES CT·Filed 2007·Granted Aug 24, 2010·3 cites·7 claims
- 1854US7932508B2Multi-value recording phase-change memory device, multi-value recording phase-change channel transistor, and memory cell arraySEMICONDUCTOR TECH ACAD RES CT·Filed 2010·Granted Apr 26, 2011·1 cites·11 claims
- 1951US6908858B2Method of fabricating semiconductor device having opening filled up with fillerSANYO ELECTRIC CO·Filed 2001·Granted Jun 21, 2005·3 cites·15 claims
- 2051US2011241203A1Semiconductor module, method for manufacturing semiconductor module, and portable apparatusNAKASATO MAYUMI·Filed 2009·Application pending·0 cites
- 2150US8183090B2Methods for manufacturing device mounting board and circuit substrateNAKASATO MAYUMI·Filed 2010·Granted May 22, 2012·0 cites·8 claims
- 2249US2009168391A1Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the sameSAITOU KOUICHI·Filed 2008·Application pending·0 cites
- 2348US2010025842A1Semiconductor module and semiconductor deviceSANYO ELECTRIC CO·Filed 2009·Application pending·0 cites
- 2447US8476776B2Semiconductor module, method for fabricating the semiconductor module, and mobile apparatusUSUI RYOSUKE·Filed 2009·Granted Jul 2, 2013·0 cites·4 claims
- 2546US6887767B2Method for manufacturing semiconductor deviceSANYO ELECTRIC CO·Filed 2003·Granted May 3, 2005·2 cites·33 claims
- 2646US2011177688A1Packaging board and manufacturing method therefor, semiconductor module and manufacturing method therefor, and portable deviceSANYO ELECTRIC CO·Filed 2011·Application pending·0 cites
- 2746US2011180933A1Semiconductor module and semiconductor module manufacturing methodINOUE YASUNORI·Filed 2009·Application pending·0 cites
- 2845US8438724B2Method for producing substrate for mounting device and method for producing a semiconductor moduleSAITOU KOUICHI·Filed 2010·Granted May 14, 2013·0 cites·7 claims
- 2944US2010078813A1Semiconductor module and method for manufacturing the semiconductor moduleOKAYAMA YOSHIO·Filed 2009·Application pending·0 cites
- 3043US9035454B2Element mounting board and semiconductor moduleSANYO ELECTRIC CO·Filed 2013·Granted May 19, 2015·0 cites·13 claims
- 3143US2007164349A1Circuit board, circuit apparatus, and method of manufacturing the circuit boardSANYO ELECTRIC CO·Filed 2006·Application pending·0 cites
- 3243US2014063767A1Circuit deviceSANYO ELECTRIC CO·Filed 2013·Application pending·0 cites
- 3343US2011074021A1Device mounting board, and semiconductor moduleSANYO ELECTRIC CO·Filed 2010·Application pending·0 cites
- 3441US2013344378A1Assembled battery and cell connection methodKOHARA YASUHIRO·Filed 2012·Application pending·0 cites
- 3538US8120007B2Phase-change memory device, phase-change channel transistor and memory cell arrayHOSAKA SUMIO·Filed 2011·Granted Feb 21, 2012·0 cites·6 claims
- 3637US6890831B2Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 2003·Granted May 10, 2005·0 cites·15 claims
- 3735US2014008679A1Substrate for mounting element and optical moduleSANYO ELECTRIC CO·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →