Surface treatment method

Abstract

According to the present invention, a plasma treatment process is performed for a surface of a metal film exposed through a resin layer, including a foreign resin substance attached to the surface, so that the foreign resin substance can be roughened without substantially damaging the resin layer; and the entire exposed surface of the metal film is etched, using a spray etching method for which an etching fluid is ejected through a nozzle, and the foreign resin substance is removed from the exposed surface.

1 . A surface treatment method comprising the steps of:
 preparing a surface of a metal film exposed through a resin layer, including a foreign resin substance attached to the surface;   performing a plasma treatment process for the surface so as to roughen the foreign resin substance without substantially damaging the resin layer; and   etching the entire exposed surface of the metal film, with using a spray etching method for which an etching fluid is ejected through a nozzle to remove the foreign resin substance from the exposed surface.   
   
   
       2 . The surface treatment method according to  claim 1 , wherein
 the metal film is deposited on at least one face of a printed circuit board, and   the surface of the metal film exposed through the resin layer is located on the same circuit board side as a pad on which an external connection terminal is formed.   
   
   
       3 . The surface treatment method according to  claim 1 , wherein
 a copper film is deposited, as a metal film, and   soft etching is performed, with using a spray etching method, so as to remove an oxide film from an exposed surface of the copper film.   
   
   
       4 . The surface treatment method according to  claim 1 , wherein
 a metal plated film is deposited with using plating as the metal film.   
   
   
       5 . The surface treatment method according to  claim 1 , wherein
 the pressure setting for the ejection, through the nozzle, of the etching fluid is from 0.1 to 0.3 MPa.   
   
   
       6 . A surface treatment method comprising the steps of:
 preparing a surface of a metal film exposed through a resin layer, including a scratch formed on the surface, and   etching the entire exposed surface of the metal film, with using a spray etching method for which an etching fluid is ejected through a nozzle to remove the scratch from the exposed surface.   
   
   
       7 . The surface treatment method according to  claim 6 , wherein
 the metal film is deposited on at least one face of a printed circuit board, and   the surface of the metal film exposed through the resin layer is located on the same circuit board side as a pad on which an external connection terminal is formed.   
   
   
       8 . The surface treatment method according to  claim 6 , wherein
 a copper film is deposited, as a metal film, and   soft etching is performed, with using a spray etching method, so as to remove an oxide film from an exposed surface of the copper film.   
   
   
       9 . The surface treatment method according to  claim 6 , wherein
 a metal plated film is deposited with using plating as the metal film.   
   
   
       10 . The surface treatment method according to  claim 6 , wherein
 the pressure setting for the ejection, through the nozzle, of the etching fluid is from 0.1 to 0.3 MPa.