Panel heat-dissipating device

Abstract

A panel heat-dissipating device includes a heat-conducting base, a vapor chamber, and at least one fin assembly. The heat-conducting base has a heat-conducting surface for allowing the vapor chamber to be thermally connected thereon. The vapor chamber forms extending portions toward the lateral of the heat-conducting base. The extending portion of the vapor chamber toward the lateral of the heat-conducting base allows the fin assembly to be disposed thereon. The fin assembly and the heat-conducting base are located to the same side of the vapor chamber. Via this arrangement, the heat-dissipating device occupies less space in the height.

1 . A panel heat-dissipating device, comprising:
 a heat-conducting base having a heat-conducting surface;   a vapor chamber thermally connected to the heat-conducting surface and forming extending portions toward a lateral of the heat-conducting base; and   a fin assembly provided on the extending portions of the vapor chamber toward the lateral of the heat-conducting base, the fin assembly and the heat-conducting base being located on the same side of the vapor chamber.   
   
   
       2 . The panel heat-dissipating device according to  claim 1 , wherein the heat-conducting base is provided thereon with locking holes for positioning. 
   
   
       3 . The panel heat-dissipating device according to  claim 1 , wherein the vapor chamber is formed into an elongate and flat plate, the heat-conducting base is provided on a middle portion of the vapor chamber, the extending portions of the vapor chamber toward the lateral of the heat-conducting base are two ends of the vapor chamber. 
   
   
       4 . The panel heat-dissipating device according to  claim 3 , further comprising another fin assembly, the two fin assemblies are located on both ends of the vapor chamber respectively. 
   
   
       5 . The panel heat-dissipating device according to  claim 1 , wherein the fin assembly is constituted of a plurality of fins, each fin is bent to form a bending edge to be attached to the vapor chamber. 
   
   
       6 . The panel heat-dissipating device according to  claim 5 , wherein the bending edge of each fin is bent to form a recessed region on the fin assembly, the recessed region allows the vapor chamber to be accommodated therein and attached to each bending edge. 
   
   
       7 . The panel heat-dissipating device according to  claim 1 , wherein the fin assembly is constituted of a plurality of fins, the outmost fin forms an outwardly-bent locking piece for positioning.