Inventor · disambiguated record
George Anthony Meyer, Iv
Also filed as: MEYER GEORGE A IV · MEYER IV GEORGE A · MEYER IV GEORGE ANTHONY
22 granted patents·32 pending applications·922 citations·filing 1989–2024
96Inventor score
Files withMEYER IV GEORGE ANTHONY28CELSIA TECHNOLOGIES TAIWAN INC9CELSIA TECH TAIWAN INC8THERMACORE INC5THERMAL CORP3
Top patents by PatentIndex Score
54 records- 0195US4880052AHeat pipe cooling plateTHERMACORE INC·Filed 1989·Granted Nov 14, 1989·157 cites·6 claims
- 0293US5642776AElectrically insulated envelope heat pipeTHERMACORE INC·Filed 1996·Granted Jul 1, 1997·177 cites·13 claims
- 0392US8059406B1Heat sink for memory and memory device having heat sinkMEYER IV GEORGE ANTHONY·Filed 2010·Granted Nov 15, 2011·27 cites·10 claims
- 0491US5168921ACooling plate with internal expandable heat pipeTHERMACORE INC·Filed 1991·Granted Dec 8, 1992·92 cites·5 claims
- 0590US7684187B1Heat dissipation deviceCELSIA TECHNOLOGIES TAIWAN INC·Filed 2008·Granted Mar 23, 2010·22 cites·8 claims
- 0690US7599185B2Cooling deviceCELSIA TECHNOLOGIES TAIWAN INC·Filed 2008·Granted Oct 6, 2009·30 cites·6 claims
- 0787US8134834B2Clamp-type heat sink for memoryMEYER IV GEORGE ANTHONY·Filed 2010·Granted Mar 13, 2012·12 cites·10 claims
- 0886US5826645AIntegrated circuit heat sink with rotatable heat pipeTHERMAL CORP·Filed 1997·Granted Oct 27, 1998·94 cites·7 claims
- 0984US5549155AIntegrated circuit cooling apparatusTHERMACORE INC·Filed 1995·Granted Aug 27, 1996·90 cites·10 claims
- 1082USD597247SHeat dissipation module for LED lampCELSIA TECHNOLOGIES TAIWAN INC·Filed 2009·Granted Jul 28, 2009·30 cites·1 claims
- 1177US12398961B2Heat exchanger device having a partially deformable heated surfaceCELSIA TECH TAIWAN INC·Filed 2024·Granted Aug 26, 2025·0 cites·10 claims
- 1277US8792238B2Heat-dissipating module having loop-type vapor chamberMEYER IV GEORGE ANTHONY·Filed 2012·Granted Jul 29, 2014·7 cites·12 claims
- 1376US8011361B2Solar power system with tower type heat dissipating structureCELSIA TECHNOLOGIES TAIWAN INC·Filed 2009·Granted Sep 6, 2011·4 cites·8 claims
- 1475US5822187AHeat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devicesTHERMAL CORP·Filed 1996·Granted Oct 13, 1998·81 cites·23 claims
- 1572USD597246SHeat dissipation module for LED lampCELSIA TECHNOLOGIES TAIWAN INC·Filed 2009·Granted Jul 28, 2009·19 cites·1 claims
- 1670US10982906B2Heat pipe with non-condensable gasCELSIA TECH TAIWAN INC·Filed 2019·Granted Apr 20, 2021·0 cites·11 claims
- 1769US2021333053A1Structure of heat pipe with adjustable working temperature rangeCELSIA TECH TAIWAN INC·Filed 2021·Application pending·0 cites
- 1868US11092386B2Manufacturing method and structure of heat pipe with adjustable working temperature rangeCELSIA TECH TAIWAN INC·Filed 2019·Granted Aug 17, 2021·0 cites·6 claims
- 1967US5764482AIntegrated circuit heat seatTHERMACORE INC·Filed 1996·Granted Jun 9, 1998·34 cites·8 claims
- 2064US7875900B2Thermally conductive structure of LED and manufacturing method thereofCELSIA TECHNOLOGIES TAIWAN INC·Filed 2008·Granted Jan 25, 2011·5 cites·10 claims
- 2164US5725050AIntegrated circuit with taped heat pipeTHERMAL CORP·Filed 1996·Granted Mar 10, 1998·31 cites·6 claims
- 2262US10571201B2Heat pipe with non-condensable gasCELSIA TECH TAIWAN INC·Filed 2017·Granted Feb 25, 2020·0 cites·8 claims
- 2359US2018164041A1Manufacturing method of phase-changing heat dissipaterCELSIA TECH TAIWAN INC·Filed 2018·Application pending·0 cites
- 2458US2010175856A1Vapor chamber with wick structure of different thickness and die for forming the sameMEYER IV GEORGE ANTHONY·Filed 2009·Application pending·0 cites
- 2557USD601515SHeat sinkCELSIA TECHNOLOGIES TAIWAN INC·Filed 2008·Granted Oct 6, 2009·10 cites·1 claims
- 2657US2011027738A1Supporting structure with height difference and vapor chamber having the supporting structureMEYER IV GEORGE ANTHONY·Filed 2009·Application pending·0 cites
- 2757US2009242169A1Heat-dissipating device with curved vapor chamberMEYER IV GEORGE ANTHONY·Filed 2008·Application pending·0 cites
- 2852US2009194259A1Vapor chamber and supporting structure thereofMEYER IV GEORGE ANTHONY·Filed 2008·Application pending·0 cites
- 2952US2016305715A1Phase-changing heat dissipater and manufacturing method thereofCELSIA TECH TAIWAN INC·Filed 2015·Application pending·0 cites
- 3052US2009205812A1Isothermal vapor chamber and support structure thereofMEYER IV GEORGE ANTHONY·Filed 2008·Application pending·0 cites
- 3149US2012325438A1Heat pipe with flexible support structureMEYER IV GEORGE ANTHONY·Filed 2011·Application pending·0 cites
- 3249US2012325437A1Flat heat pipe with capilllary structureMEYER IV GEORGE ANTHONY·Filed 2011·Application pending·0 cites
- 3349US2010309671A1Led lamp heat dissipating moduleMEYER IV GEORGE ANTHONY·Filed 2009·Application pending·0 cites
- 3449US2023262935A1Heat dissipation device and anti-vibration heat conduction structure thereofCELSIA TECH TAIWAN INC·Filed 2022·Application pending·0 cites
- 3549US2011069500A1Heat Dissipation Module For Bulb Type LED LampMEYER IV GEORGE ANTHONY·Filed 2009·Application pending·0 cites
- 3648US2012285662A1Vapor chamber with improved sealed openingMEYER IV GEORGE ANTHONY·Filed 2011·Application pending·0 cites
- 3748US2012279687A1Flat-type heat pipe and wick structure thereofMEYER IV GEORGE ANTHONY·Filed 2011·Application pending·0 cites
- 3846US2011094723A1Combination of fastener and thermal-conducting memberMEYER IV GEORGE ANTHONY·Filed 2009·Application pending·0 cites
- 3945US2011056670A1Heat sinkMEYER IV GEORGE ANTHONY·Filed 2009·Application pending·0 cites
- 4045US2011067850A1Buckling Device with Cooling FunctionMEYER IV GEORGE ANTHONY·Filed 2009·Application pending·0 cites
- 4145US2010243212A1Non-flat vapor chamber with stiffening plateMEYER IV GEORGE ANTHONY·Filed 2009·Application pending·0 cites
- 4244US2010065247A1Cooling mechanism for electronic devicesMEYER IV GEORGE ANTHONY·Filed 2008·Application pending·0 cites
- 4344US2009223651A1Panel heat-dissipating deviceMEYER IV GEORGE ANTHONY·Filed 2008·Application pending·0 cites
- 4444US2009190304A1Cooling device for memory moduleMEYER IV GEORGE ANTHONY·Filed 2008·Application pending·0 cites
- 4544US2010134982A1Memory heat dissipating structure and memory device having the sameMEYER IV GEORGE ANTHONY·Filed 2008·Application pending·0 cites
- 4642US2007240860A1Support structure for a planar cooling deviceCELSIA TECHNOLOGIES KOREA INC·Filed 2006·Application pending·0 cites
- 4741US2012186798A1Cooling module for led lampMEYER IV GEORGE ANTHONY·Filed 2011·Application pending·0 cites
- 4839US2010006267A1Covered plate-type heat pipeMEYER IV GEORGE ANTHONY·Filed 2008·Application pending·0 cites
- 4939US2010006268A1Vapor chamber and supporting structure of the sameMEYER IV GEORGE ANTHONY·Filed 2008·Application pending·0 cites
- 5037US2013168052A1Heat pipe and composition of capillary wick thereofMEYER IV GEORGE ANTHONY·Filed 2011·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →