Heat-dissipating device with curved vapor chamber

Abstract

A heat-dissipating device includes a vapor chamber shown as a flat long plate, a heat-dissipating plate superposed on the vapor chamber, and a first fin set. The middle portion of the vapor chamber is designed as a heated section, two sides of which respectively have a condensing section. Two curvedly extending sections are respectively disposed between the heated section and the condensing sections. Each condensing section is extended to a higher position of the heated section through the bending of each extending section. The heat-dissipating plate is horizontally attached onto the two condensing sections, thus that a section-differential space formed between the heat-dissipating plate and the heated section accommodates the first fin set thermally contacted with the heated section of the vapor chamber.

1 . A heat-dissipating device with a vapor chamber in curved configuration, including:
 a chamber, which is shown as a flat long plate, a middle portion of which is designed as a heated section, and two sides of which respectively have a condensing section, while two curvedly extending sections are respectively disposed between the heated section and the condensing sections and each condensing section is extended to a higher position of the heated section through a bending of each extending section;   a heat-dissipating plate, which is superposed on the vapor chamber and is horizontally attached onto the two condensing sections, whereby a section-differential space formed between the heat-dissipating plate and the heated section accommodates the first fin set thermally contacted with the heated section of the vapor chamber; and   a first fin set, which is accommodated in the section-differential space and thermally contacted with the heated section of the vapor chamber.   
   
   
       2 . The heat-dissipating device of vapor chamber according to  claim 1 , wherein the two condensing sections of the vapor chamber are formed as a symmetrical configuration. 
   
   
       3 . The heat-dissipating device of vapor chamber according to  claim 1 , further including a plurality of the aforementioned vapor chambers arranged in parallel. 
   
   
       4 . The heat-dissipating device of vapor chamber according to  claim 3 , wherein the first fin set is arranged across the heated sections of the vapor chambers. 
   
   
       5 . The heat-dissipating device of vapor chamber according to  claim 1 , wherein a second fin set is further arranged on the heat-dissipating plate. 
   
   
       6 . The heat-dissipating device of vapor chamber according to  claim 1 , wherein a distance is kept between a top part of the first fin set and the heat-dissipating plate. 
   
   
       7 . The heat-dissipating device of vapor chamber according to  claim 1 , wherein a top part of the first fin set is thermally contacted with the heat-dissipating plate.