Cooling module for led lamp

Abstract

A cooling module for an LED lamp includes a thermostatic plate, a hollow column, and a plurality of cooling fins. The thermostatic plate has an evaporating segment and a pair of condensing segments extending from the evaporating segment. The outer surface of the hollow column has a pair of grooves corresponding to each other. The condensing segments of the thermostatic plate are buried in the grooves. The cooling fins surround and thermally contact the outer rim of the hollow column and the condensing segments.

1 . A cooling module for an LED lamp, comprising:
 a thermostatic plate, comprising an evaporating segment and a pair of condensing segments extending from the evaporating segment;   a hollow column, the outer surface of which having a pair of grooves corresponding to each other, the pair of condensing segments of the thermostatic plate being buried in the pair of grooves; and   a plurality of cooling fin, surrounding and thermally contacting the outer rim of the hollow column and the pair of condensing segments.   
     
     
         2 . The cooling module of  claim 1 , further comprising a heat conducting base, the evaporating segment of the thermostatic plate thermally contacting the heat conducting base. 
     
     
         3 . The cooling module of  claim 2 , wherein the thermostatic plate has a U-shape, the evaporating segment is formed on a latitudinal part of the thermostatic plate, and the pair of condensing segments are formed on a longitudinal part of the thermostatic plate. 
     
     
         4 . The cooling module of  claim 3 , wherein the latitudinal cross-section of each of the condensing segments has an arc-shape with an inner cambered surface and an outer cambered surface, the inner cambered surfaces are attached to the hollow column, the outer cambered surfaces are attached to the cooling fins. 
     
     
         5 . The cooling module of  claim 4 , wherein together the outer cambered surfaces and the outer surface of the hollow column form a circular rim. 
     
     
         6 . The cooling module of  claim 2 , wherein the heat conducting base has a container trough, a through opening is formed in the bottom of the container trough, the evaporating segment is placed inside the container trough, and on the position corresponding to the through opening the evaporating segment has a flat surface that is exposed and at the same level with the bottom surface of the heat conducting base. 
     
     
         7 . The cooling module of  claim 6 , further comprising a cooling body, the cooling body having thermal contact with the evaporating segment. 
     
     
         8 . The cooling module of  claim 7 , wherein the cooling body further has a bottom plate attached to the evaporating segment and a plurality of cooling columns extending from the bottom plate. 
     
     
         9 . The cooling module of  claim 8 , wherein the bottom plate has a pair of protruding plates, two sides of the container trough of the heat conducting base have two steps corresponding to the protruding plates, and the protruding plates are embedded in the steps. 
     
     
         10 . The cooling module of  claim 1 , wherein each of the cooling fins has an L-shape, the shorter sides of the L-shapes are attached to the hollow column or the pair of the condensing segments, and the longer sides of the L-shapes are arranged as if they are emanated from the outer rim of the hollow column and the pair of condensing segments. 
     
     
         11 . The cooling module of  claim 10 , wherein the free ends of the cooling fins have a plurality of through troughs.