Cooling mechanism for electronic devices

Abstract

A cooling mechanism for cooling a enclosed cabinet of electronic device, which comprises a heat-conducting plate having accommodating grooves at one side. Vapor chambers disposed within accommodating grooves of the heat-conducting plate. And a cooling fin set which is arranged on an arbitrary side of the heat-conducting plate to compose a heat exchanger. Part of the heat exchanger is disposed outside of the cabinet to conduct heat inside of the cabinet to outside.

1 . A cooling mechanism for an electronic device, which disposed a heat exchanger on a side of a cabinet, the heat exchanger comprising:
 a heat-conducting plate having an accommodating groove on one side thereof,   a vapor chamber disposed in the accommodating groove, and comprising a working fluid and capillary wick therein; and   a cooling fin set arranged on one side of the heat-conducting plate;   wherein a part of the heat exchanger is disposed outside of the cabinet, and an another part of the heat exchanger set is disposed inside of the cabinet.   
   
   
       2 . The cooling mechanism according to  claim 1 , wherein a cross section of the accommodating groove is configured as a “U” shape with a flat bottom. 
   
   
       3 . The cooling mechanism according to  claim 1 , wherein a top surface of the vapor chamber is coplanar with that of the heat-conducting plate, and a bottom of the cooling fin set planarly contacts with the top surfaces of the vapor chamber and the heat-conducting plate. 
   
   
       4 . The cooling mechanism according to  claim 1 , wherein the cooling fin set is a cooling fin set with aluminum-extruding type. 
   
   
       5 . The cooling mechanism according to  claim 1 , wherein a plurality of the heat exchangers are stacked as a heat exchanger set.