Interconnect system

Abstract

A test contact may include a first portion having an open-ended rounded shape. The first portion may define an opening therethrough. The test contact may include a second portion having a curved structure. The first portion and the second portion may be formed integrally, and the second portion may be configured to contact a portion of a device lead.

1 . A test contact comprising:
 a first portion having an open-ended rounded shape, wherein the first portion defines an opening therethrough; and   a second portion having a curved structure,   wherein the first portion and the second portion are formed integrally,   wherein the second portion is configured to contact a portion of a device lead.   
   
   
       2 . The test contact of  claim 1 , wherein the opening is configured to surround an elastomer element. 
   
   
       3 . The test contact of  claim 1 , wherein the first and second portions comprise beryllium copper. 
   
   
       4 . The test contact of  claim 1 , wherein the second portion is configured to wipe against the portion of the device lead to remove contaminants from the portion of the device lead. 
   
   
       5 . The test contact of  claim 1 , wherein the second portion is configured to wipe against the portion of the device lead to remove contaminants from the second portion. 
   
   
       6 . The test contact of  claim 1 , wherein the test contact has a compliance similar to a compliance of a spring contact probe. 
   
   
       7 . The test contact of  claim 1 , wherein a temperature rise associated with the test contact during use is less than 80° C. when 5 Amps of electrical current is applied to the test contact. 
   
   
       8 . The test contact of  claim 1 , wherein an average pin resistance associated with the test contact is less than 20 mΩ. 
   
   
       9 . An interconnect system comprising:
 a testing board;   a device under test;   one or more elastomer elements; and   one or more contacts, wherein each contact comprises:
 a first portion having an open-ended rounded shape, wherein the first portion defines an opening therethrough, wherein the opening is configured to surround one of the elastomer elements, and 
 a second portion having a curved structure, 
   wherein each contact is configured to provide an electrical interconnection between the testing board and the device under test,   wherein the second portion of each contact is configured to remove contaminants from a portion of a lead of the device under test.   
   
   
       10 . The interconnect system of  claim 9 , wherein at least a portion of the second portion of a contact is configured to extend beyond an edge of the interconnect system during a board compressed state. 
   
   
       11 . The interconnect system of  claim 9 , wherein the second portion of a contact is configured to be substantially contained within the interconnect system during a board testing state. 
   
   
       12 . The interconnect system of  claim 9 , wherein the second portion of a contact is configured to remove contaminants from a portion of a lead of the device under test during a board testing state. 
   
   
       13 . The interconnect system of  claim 9 , wherein the second portion of a contact is configured to wipe against a portion of a lead of the device under test to remove contaminants from the second portion. 
   
   
       14 . The interconnect system of  claim 9 , wherein each contact is configured to be removable from the interconnect system. 
   
   
       15 . The interconnect system of  claim 9 , wherein a contact comprises beryllium copper. 
   
   
       16 . The interconnect system of  claim 9 , wherein a temperature rise associated with at least one contact during use is less than 80° C. at 5 Amps. 
   
   
       17 . The interconnect system of  claim 9 , wherein an average pin resistance associated with at least one contact is less than 20 mΩ.