Linked Chip Attach And Underfill

Abstract

An integrated circuit packaging method, system and apparatus for maintaining a predetermined temperature between reflow and underfill dispense are disclosed.

1 - 9 . (canceled) 
   
   
       10 . A system comprising:
 a chip attach module adapted to place an integrated circuit onto a package substrate;   a reflow module coupled to the chip attach module adapted melt solder for attaching the integrated circuit to the package substrate;   a heated buffer coupled to the reflow module adapted to maintain the temperature of the integrated circuit and package assembly at or above a predetermined temperature prior to dispensing an underfill between the package substrate and the integrated circuit;   an underfill dispenser coupled to the heated buffer adapted to dispense an underfill material between the package substrate and the integrated circuit; and   a first curing oven coupled to the underfill dispenser adapted to cure the underfill material in the integrated circuit and package assembly to a first level of curing and further adapted to cure the underfill material to a second level of curing wherein the second level of curing is greater than the first level of curing.   
   
   
       11 . The system of  claim 10  further comprising a prebaking oven coupled to the heated buffer adapted to prebake the assembly prior to being transported to the underfill dispenser. 
   
   
       12 . The system of  claim 10  further comprising a conveyorized connection adapted to couple the reflow module to the heated buffer thermally or mechanically or combinations thereof. 
   
   
       13 . The system of  claim 10  further comprising a conveyorized connection adapted to couple the heated buffer to the underfill dispenser thermally or mechanically or combinations thereof. 
   
   
       14 . The system of  claim 10  wherein the predetermined temperature is approximately 120° C. 
   
   
       15 . The system of  claim 10  further comprising a second curing oven adapted to cure the underfill material to a second level of curing. 
   
   
       16 . An apparatus comprising:
 a heated buffer adapted to couple a reflow module with an underfill dispenser on an integrated circuit packaging assembly line, wherein the heated buffer comprises one or more support elements adapted to support one or more integrated circuit package assemblies at a predetermined temperature.   
   
   
       17 . The apparatus of  claim 16  wherein the one or more support elements comprise one or more magazine racks. 
   
   
       18 . The apparatus of  claim 17  wherein the one or more magazine racks are are first in first out random access magazine racks. 
   
   
       19 . The apparatus of  claim 17  wherein the one or more magazine racks are last in first out random access racks. 
   
   
       20 . The apparatus of  claim 16  wherein the predetermined temperature is approximately 120° C.