Inventor · disambiguated record
Edward A. Zarbock
Also filed as: ZARBOCK EDWARD A
9 granted patents·6 pending applications·877 citations·filing 2000–2016
90Inventor score
Top patents by PatentIndex Score
15 records- 0198US9368429B2Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chipsMA QING·Filed 2012·Granted Jun 14, 2016·86 cites·16 claims
- 0298US6924551B2Through silicon via, folded flex microelectronic packageINTEL CORP·Filed 2003·Granted Aug 2, 2005·652 cites·23 claims
- 0396US7373033B2Chip-to-chip optical interconnectINTEL CORP·Filed 2006·Granted May 13, 2008·67 cites·19 claims
- 0494US9570883B2Photonic package architectureZARBOCK EDWARD A·Filed 2011·Granted Feb 14, 2017·43 cites·11 claims
- 0583US8004076B2Microelectronic package with carbon nanotubes interconnect and method of making sameINTEL CORP·Filed 2008·Granted Aug 23, 2011·13 cites·18 claims
- 0680US7588968B1Linked chip attach and underfillINTEL CORP·Filed 2008·Granted Sep 15, 2009·9 cites·9 claims
- 0779US7629203B2Thermal interface material for combined reflowINTEL CORP·Filed 2008·Granted Dec 8, 2009·5 cites·22 claims
- 0863US9190388B2Using an optically transparent solid material as a support structure for attachment of a semiconductor material to a substrateSANKMAN ROBERT L·Filed 2011·Granted Nov 17, 2015·1 cites·19 claims
- 0951US6376007B1Method of marking glassMOTOROLA INC·Filed 2000·Granted Apr 23, 2002·1 cites·21 claims
- 1050US2009293266A1Linked Chip Attach And UnderfillZARBOCK EDWARD A·Filed 2009·Application pending·0 cites
- 1147US2017108655A1Photonic package architectureINTEL CORP·Filed 2016·Application pending·0 cites
- 1246US2007284730A1Method, apparatus, and system for thin die thin thermal interface material in integrated circuit packagesSHI WEI·Filed 2006·Application pending·0 cites
- 1344US2010246138A1Method, apparatus, and system for thin die thin thermal interface material in integrated circuit packagesSHI WEI·Filed 2010·Application pending·0 cites
- 1439US2006273454A1Locking mechanism for die assemblyLU DAOGIANG·Filed 2005·Application pending·0 cites
- 1538US2014206185A1Ball placement in a photo-patterned template for fine pitch interconnectLEI MING·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Edward A. Zarbock files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →