Photonic package architecture

Abstract

A photonic package includes a photonic device having a photon emitter on the front side of the die. A beam of photons from the photon emitter passing from the front side to the backside of the die, passes through the substrate material of the die which is substantially transparent to the beam of photons, to the backside of the die. Other embodiments are also described.

1 . A method, comprising:
 forming a photon emitter on the front side of a die; and   forming a beam path on the front side of the die and positioned to direct a beam of photons from the photon emitter on the front side of the die, through the semiconductor material of the body of the die, and to the backside of the die.   
     
     
         2 . The method of  claim 1  wherein the beam path forming includes forming a first mirror on the front side of the die and positioned to reflect a beam of photons from the photon emitter on the front side of the die, through the semiconductor material of the body of the die, and to the backside of the die. 
     
     
         3 . The method of  claim 1  wherein the photon emitter forming includes doping semiconductor regions on the front side of the die. 
     
     
         4 . The method of  claim 2  wherein the first mirror forming includes etching a beveled surface at the front side of the die and depositing photon reflective metal on the beveled surface. 
     
     
         5 . The method of  claim 1  wherein the photon emitter is a laser. 
     
     
         6 . A method, comprising:
 coupling an optical coupler to the backside of a first die having a photon emitter on the front side of the first die, and a beam path on the front side of the first die and positioned to direct a beam of photons from the photon emitter on the front side of the first die, and through the semiconductor material of the body of the first die, and to the backside of the first die;   wherein said coupling includes positioning the optical coupler to receive the beam of photons from the backside of the first die.   
     
     
         7 . The method of  claim 6  wherein the beam path of the first die includes a first mirror on the front side of the first die and positioned to reflect a beam of photons from the photon emitter on the front side of the first die, and through the material of the body of the first die, and to the backside of the first die. 
     
     
         8 . The method of  claim 7  wherein said coupling further comprises positioning a second mirror of the optical coupler to reflect the beam of photons from the backside of the first die. 
     
     
         9 . The method of  claim 6  further comprising thermally coupling a heat sink to the backside of the first die and positioned to draw heat energy generated by circuitry including the photon emitter on the front side of the first die. 
     
     
         10 . The method of  claim 9  further comprising positioning the optical coupler in a recess defined by a heat sink. 
     
     
         11 . The method of  claim 6  wherein said coupling further comprises attaching the optical coupler to the backside of the first die using an optically transmissive adhesive. 
     
     
         12 . The method of  claim 9  wherein said thermal coupling further comprises attaching the heat sink to the backside of the first die using a thermally transmissive adhesive. 
     
     
         13 . The method of  claim 8  wherein said coupling further comprises positioning a lens of the optical coupler to focus the beam of photons reflected by the second mirror. 
     
     
         14 . The method of  claim 13  further comprising coupling a photon beam conduit to the optical coupler so that the photon beam conduit is positioned to receive the beam of photons focused by the lens of the optical coupler. 
     
     
         15 . The method of  claim 6  further comprising electrically coupling a second die having a photon emitter driver circuit, to the front side of the first die, for driving the photo emitter of the first die. 
     
     
         16 . The method of  claim 15  comprising electrically coupling an interposer having a central aperture to a substrate. 
     
     
         17 . The method of  claim 16  further comprising electrically coupling the front side of the first die to the interposer with the second die disposed within the aperture of the interposer. 
     
     
         18 . The method of  claim 6  wherein said coupling further comprises positioning the optical coupler in a recess defined by a heat sink, attaching the heat sink to the backside of the first die using a thermally transmissive adhesive and attaching the optical coupler within the heat sink recess, to the backside of the first die using an optically transmissive adhesive. 
     
     
         19 - 37 . (canceled) 
     
     
         38 . A system, comprising:
 a processor;   a memory coupled to the processor;   a video controller coupled to the memory and the processor; and   a package having a die of semiconductor material, said die having a photon emitter on the front side of the die, and a beam path on the front side of the die and positioned to direct a beam of photons from the photon emitter on the front side of the die, through the semiconductor material of the body of the die, and to the backside of the die.   
     
     
         39 . The system of claim  40  wherein the beam path includes a first mirror on the front side of the die and positioned to reflect a beam of photons from the photon emitter on the front side of the die, through the semiconductor material of the body of the die, and to the backside of the die, the package further comprising an optical coupler positioned at the backside of the first die to receive the beam of photons from the backside of the first die; a heat sink thermally coupled to the backside of the die and positioned to draw heat energy generated by circuitry including the photon emitter on the front side of the first die wherein the heat sink defines a recess and the optical coupler is received in the heat sink recess; a layer of optically transmissive adhesive affixing the optical coupler to the backside of the die; a layer of thermally transmissive adhesive affixing the heat sink to the backside of the die; a second die having a photon emitter driver circuit, said second die being coupled to the front side of the die having the photon emitter, for driving the photon emitter; a substrate; and an interposer having a central aperture, said interposer coupled to the substrate, wherein the front side of the die having the photon emitter is coupled to the interposer with the second die disposed within the aperture of the interposer.