Wafer Prober Integrated With Full-Wafer Contacter

Abstract

Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober, removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer.

1 . An apparatus for coupling a plurality of electrical pathways to a wafer, comprising:
 a wafer prober, the wafer prober including a top plate and a vacuum hold down chuck;   an attachment means disposed on an underside of the top plate;   a vacuum source ring disposed around an outer circumference of the vacuum hold down chuck; and   a wafer translator mechanically coupled to a mounting fixture;   wherein the mounting fixture is removably attached to the attachment means.