Adhesive layer forming liquid and adhesive layer forming process

Abstract

The object of the invention is to provide an adhesive layer forming liquid capable of maintaining the performance of forming an adhesive layer easily and keeping adhesive property to a resin certainly, and an adhesive layer forming process using the liquid. The adhesive layer forming liquid of the invention is an adhesive layer forming liquid for forming an adhesive layer for bonding a copper and a resin to each other, which is an aqueous solution comprising an acid, a stannous salt, a stannic salt, a complexing agent, and a stabilizer, and which is prepared to set the value of B/A to 0.010 or more and 1.000 or less at the time of the preparation, wherein A represents the concentration (unit: % by mass) of the stannous salt as the concentration of bivalent tin ions, and B represents the concentration (unit: % by mass) of the stannic salt as the concentration of tetravalent tin ions.

1 . An adhesive layer forming liquid for forming an adhesive layer for bonding a copper and a resin to each other,
 which is an aqueous solution comprising an acid, a stannous salt, a stannic salt, a complexing agent, and a stabilizer, and   which is prepared to set the value of B/A to 0.010 or more and 1.000 or less at the time of the preparation, wherein A represents the concentration (unit: % by mass) of the stannous salt as the concentration of bivalent tin ions, and B represents the concentration (unit: % by mass) of the stannic salt as the concentration of tetravalent tin ions.   
     
     
         2 . The adhesive layer forming liquid according to  claim 1 , wherein A is from 0.05 to 10.00, and B is from 0.01 to 5.00. 
     
     
         3 . The adhesive layer forming liquid according to  claim 1 , wherein the complexing agent is at least one selected from thioureas and thiourea derivatives. 
     
     
         4 . The adhesive layer forming liquid according to  claim 1 , wherein the stabilizer is at least one selected from glycols and glycol esters. 
     
     
         5 . An adhesive layer forming process for forming an adhesive layer for bonding a copper and a resin to each other,
 comprising the step of processing a surface of the copper with the adhesive layer forming liquid as recited in  claim 1 .   
     
     
         6 . The adhesive layer forming process according to  claim 5 , wherein the step of processing the copper surface is the step of immersing the copper surface into the adhesive layer forming liquid. 
     
     
         7 . The adhesive layer forming process according to  claim 5 , further comprising the step of processing, with a tin stripping solution, the surface of the adhesive layer obtained after the step of processing the copper surface. 
     
     
         8 . The adhesive layer forming process according to  claim 7 , wherein the tin stripping solution is a solution of nitric acid in water.