Assignee
MEC CO LTD
JP·46 granted patents·23 pending applications·639 citations·filing 1990–2024
Top patents by PatentIndex Score
69 records- 0190US5532094AComposition for treating copper or copper alloy surfacesMEC CO LTD·Filed 1995·Granted Jul 2, 1996·96 cites·6 claims
- 0289US5965036AMicroetching composition for copper or copper alloyMEC CO LTD·Filed 1997·Granted Oct 12, 1999·82 cites·15 claims
- 0388US6426020B1Etchant for copper or copper alloysMEC CO LTD·Filed 2000·Granted Jul 30, 2002·58 cites·20 claims
- 0484US5807493AMicroetching method for copper or copper alloyMEC CO LTD·Filed 1996·Granted Sep 15, 1998·59 cites·5 claims
- 0583US5496590AComposition for treating copper and copper alloy surfaces and method for the surface treatmentMEC CO LTD·Filed 1994·Granted Mar 5, 1996·32 cites·3 claims
- 0683US5435860ABenzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the sameMEC CO LTD·Filed 1994·Granted Jul 25, 1995·26 cites·4 claims
- 0781US5035749AProcess for removing tin and tin-lead alloy from copper substratesMEC CO LTD·Filed 1990·Granted Jul 30, 1991·39 cites·3 claims
- 0877US5700389AEtching solution for copper or copper alloyMEC CO LTD·Filed 1995·Granted Dec 23, 1997·43 cites·13 claims
- 0971US9011712B2Microetching solution for copper, replenishment solution therefor and method for production of wiring boardMEC CO LTD·Filed 2013·Granted Apr 21, 2015·2 cites·10 claims
- 1071US6746621B2Micro-etching composition for copper or copper alloy, micro-etching method, and method for manufacturing printed circuit boardMEC CO LTD·Filed 2001·Granted Jun 8, 2004·16 cites·10 claims
- 1171US5439783AComposition for treating copper or copper alloysMEC CO LTD·Filed 1994·Granted Aug 8, 1995·20 cites·7 claims
- 1269US7285229B2Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the sameMEC CO LTD·Filed 2004·Granted Oct 23, 2007·10 cites·11 claims
- 1366US11053594B2Microetchant for copper and method for producing wiring boardMEC CO LTD·Filed 2020·Granted Jul 6, 2021·0 cites·20 claims
- 1465US6733886B2Laminate and method of manufacturing the sameMEC CO LTD·Filed 2002·Granted May 11, 2004·9 cites·14 claims
- 1565US5788830AElectroplating processMEC CO LTD·Filed 1996·Granted Aug 4, 1998·22 cites·6 claims
- 1665US5476947ABenzimidazole derivative and composition for treating copper and copper alloy surfaces comprising the sameMEC CO LTD·Filed 1994·Granted Dec 19, 1995·14 cites·2 claims
- 1764US2010029969A1Copper compound and method for producing copper thin film using the sameMEC CO LTD·Filed 2009·Application pending·0 cites
- 1862US12404287B2Chemical compound, surface treating agent, surface treating method, and production method for metal-resin compositeMEC CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·11 claims
- 1961US12157837B2Adhesive composition, method for producing surface-treated metal member, and method for producing metal-resin composite bodyMEC CO LTD·Filed 2020·Granted Dec 3, 2024·0 cites·10 claims
- 2061US2025381760A1Method for Producing Aluminum-Resin Composite, and Surface Treatment AgentMEC CO LTD·Filed 2023·Application pending·0 cites
- 2159US5547558AProcess for electroplating nonconductive surfaceMEC CO LTD·Filed 1995·Granted Aug 20, 1996·16 cites·1 claims
- 2258US11230644B1Coating film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin compositeMEC CO LTD·Filed 2021·Granted Jan 25, 2022·0 cites·6 claims
- 2358US11208726B2Microetching agent for copper, copper surface roughening method and wiring board production methodMEC CO LTD·Filed 2018·Granted Dec 28, 2021·0 cites·2 claims
- 2457US10174428B2Etchant, replenishment solution and method for forming copper wiringMEC CO LTD·Filed 2016·Granted Jan 8, 2019·1 cites·9 claims
- 2557US2026043144A1Copper etchantMEC CO LTD·Filed 2023·Application pending·0 cites
- 2656US11937573B2Music providing system for non-human animalMEC CO LTD·Filed 2019·Granted Mar 26, 2024·0 cites·10 claims
- 2756US5885476AComposition for microetching copper or copper alloyMEC CO LTD·Filed 1997·Granted Mar 23, 1999·23 cites·8 claims
- 2856US2025207069A1Cleaning agent, cleaning method and supplementary liquidMEC CO LTD·Filed 2023·Application pending·0 cites
- 2955US2010000971A1Adhesive layer forming liquidMEC CO LTD·Filed 2009·Application pending·0 cites
- 3054US2008308964A1Method for forming film of silane coupling agentMEC CO LTD·Filed 2008·Application pending·0 cites
- 3153US2010108531A1Adhesive layer forming liquid and adhesive layer forming processMEC CO LTD·Filed 2009·Application pending·0 cites
- 3252US9441303B2Microetching solution for copper, replenishment solution therefor and method for production of wiring boardMEC CO LTD·Filed 2013·Granted Sep 13, 2016·0 cites·11 claims
- 3352US7029761B2Bonding layer for bonding resin on copper surfaceMEC CO LTD·Filed 2004·Granted Apr 18, 2006·5 cites·7 claims
- 3452US6106899AMethod for surface treatment of copper or copper alloysMEC CO LTD·Filed 1998·Granted Aug 22, 2000·17 cites·15 claims
- 3552US2021387255A1Copper powder for 3d printing, method for producing copper powder for 3d printing, method for producing 3d printed article, and 3d printed articleMEC CO LTD·Filed 2019·Application pending·0 cites
- 3652US2020109475A1Etching methodMEC CO LTD·Filed 2019·Application pending·0 cites
- 3751US10329453B2Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin compositeMEC CO LTD·Filed 2017·Granted Jun 25, 2019·0 cites·7 claims
- 3851US6220540B1Mechanism for retaining one tape deck in inoperative position in double cassette tape playerMEC CO LTD·Filed 2000·Granted Apr 24, 2001·2 cites·9 claims
- 3950US9932678B2Microetching solution for copper, replenishment solution therefor and method for production of wiring boardMEC CO LTD·Filed 2016·Granted Apr 3, 2018·0 cites·7 claims
- 4050US7431861B2Etchant, replenishment solution and method for producing copper wiring using the sameMEC CO LTD·Filed 2004·Granted Oct 7, 2008·8 cites·10 claims
- 4150US2019003062A1Microetchant for copper and method for producing wiring boardMEC CO LTD·Filed 2017·Application pending·0 cites
- 4249US12460303B2Etching agent and method for producing circuit boardMEC CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·17 claims
- 4348US5334261ASoldering flux composition and solder paste compositionMEC CO LTD·Filed 1993·Granted Aug 2, 1994·15 cites·7 claims
- 4448US2008011981A1Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the sameMEC CO LTD·Filed 2007·Application pending·0 cites
- 4547US2007277736A1Method for manufacturing substrate, and vapor deposition apparatus used for the sameMEC CO LTD·Filed 2007·Application pending·0 cites
- 4646US2005003086A1Copper compound and method for producing copper thin film using the sameMEC CO LTD·Filed 2004·Application pending·0 cites
- 4745US2008073614A1Metal removing solution and metal removing method using the sameMEC CO LTD·Filed 2007·Application pending·0 cites
- 4844US10801112B2Composition for forming coating, production method for surface-treated metal member, and production method for metal-resin compositeMEC CO LTD·Filed 2017·Granted Oct 13, 2020·0 cites·14 claims
- 4943US10883027B2Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin compositeMEC CO LTD·Filed 2018·Granted Jan 5, 2021·0 cites·11 claims
- 5043US7156904B2Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained therebyMEC CO LTD·Filed 2004·Granted Jan 2, 2007·3 cites·18 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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