Apparatus for providing controlled impedance in an electrical contact

Abstract

An apparatus for providing a controlled impedance directly to predetermined contact elements within a socket, thereby reducing the “distorting” nature of the electrical interconnection system. In an illustrative embodiment of the present invention, predetermined contacts of a socket may have a resistance, inductance, capacitance, or a combination thereof incorporated therein. In another illustrative embodiment, at least one active element(s) may also be incorporated into predefined contacts. In this manner, predefined contacts may “process” the corresponding signal in a predetermined manner, defined by the circuitry incorporated on the contact itself. Illustrative functions that may be performed include, but are not limited to, amplifying, analog-to-digital converting, digital-to-analog converting, predefined logic functions, or any other function that may be performed via a combination of active and/or passive elements including a microprocessor function.

1 - 39 . (canceled) 
   
   
       40 . Apparatus for electrically interconnecting leads of a packaged semiconductor device to corresponding pads spaced at a distance from the leads, comprising:
 (a) a housing, said housing having contact receiving slots formed therein, said housing having a surface intersected by said contact receiving slots, each of said contact receiving slots extending substantially parallel to an axis extending between a spaced corresponding lead and pad, said packaged semiconductor being able to be positioned relative to said housing proximate said contact receiving slots;   (b) each lead from said semiconductor engaging one of a plurality of contacts received within said contact receiving slots, and each contact further engaging a corresponding pad, wherein each pad completes a signal path, each of said contacts providing means for electrically affecting a signal transiting said signal path between at least one lead and corresponding pad; and   (c) each of said contacts comprising a monolithically fabricated active device element.   
   
   
       41 - 43 . (canceled) 
   
   
       44 . Apparatus according to  claim 40  wherein said plurality of contacts is coupled to a plurality of pads. 
   
   
       45 - 48 . (canceled) 
   
   
       49 . Apparatus according to  claim 40  wherein each of said contact receiving slots registers with a corresponding lead of the monolithically fabricated active components. 
   
   
       50 - 51 . (canceled)