Conformal shielding employing segment buildup

Abstract

A meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

1 . A method of manufacturing a module comprising:
 providing an electronic meta-module comprising a substrate, a plurality of component areas on a surface of the substrate for a plurality of modules, and a body formed from a dielectric material that covers the plurality of component areas, wherein certain component areas of the plurality of component areas are associated with metallic structures that are covered by the body, each of the metallic structures comprising:
 a bottom metallic element on the surface of the substrate; and 
 a top metallic element above the first metallic element; 
   exposing at least a portion of the top metallic element of the metallic structures associated with the certain component areas through the body to provide a plurality of exposed metallic structures; and   applying an electromagnetic shield material over at least portions of an exterior surface of the body for each of the certain component areas and on the plurality of exposed metallic structures to form electromagnetic shields over the certain component areas.   
   
   
       2 . The method of  claim 1  wherein exposing the at least a portion of the metallic structures associated with the certain component areas through the body comprises at least one of cutting and drilling through the body to the top metallic element for each of the exposed metallic structures. 
   
   
       3 . The method of  claim 2  wherein exposing the at least a portion of the metallic structures associated with the certain component areas through the body comprises at least one of cutting and drilling into the top metallic element for each of the exposed metallic structures. 
   
   
       4 . The method of  claim 3  wherein exposing the at least a portion of the metallic structures associated with the certain component areas through the body comprises at least one of cutting and drilling into the top metallic element without cutting or drilling through the bottom metallic element for each of the exposed metallic structures. 
   
   
       5 . The method of  claim 1  wherein the top metallic element is located directly on the bottom metallic element. 
   
   
       6 . The method of  claim 1  wherein the bottom metallic element for each of the metallic structures is formed from a metal layer on the surface of the substrate. 
   
   
       7 . The method of  claim 1  further comprising forming the top metallic element using a plating process. 
   
   
       8 . The method of  claim 7  wherein the top metallic element is plated directly on the bottom metallic element using the plating process. 
   
   
       9 . The method of  claim 1  wherein the top metallic element comprises a metallic body, and further comprising placing the metallic body on the bottom metal element for each of the metallic structures. 
   
   
       10 . The method of  claim 1  wherein the bottom metal element comprises a continuous metal trace for each of the metallic structures. 
   
   
       11 . The method of  claim 10  wherein a plurality of metallic bodies are placed on the continuous metal trace for each of the metallic structures. 
   
   
       12 . The method of  claim 1  further comprising separating the plurality of modules of the electronic meta-module from each other, wherein each module comprises at least one of the certain component areas having one of the electromagnetic shields. 
   
   
       13 . The method of  claim 1  further comprising exposing the exterior surface of the body to a reactive process gas to remove contaminants on the exterior surface of the body prior to applying the electromagnetic shield material. 
   
   
       14 . The method of  claim 1  further comprising roughening the exterior surface of the body prior to applying the electromagnetic shield material. 
   
   
       15 . The method of  claim 1  wherein applying the electromagnetic shield material comprises plating at least one conductive material over the at least portions of the exterior surface of the body and on the exposed metallic elements. 
   
   
       16 . The method of  claim 15  wherein plating the at least one conductive material comprises plating a first layer with an electroless plating process and plating a second layer with an electrolytic plating process. 
   
   
       17 . The method of  claim 1  wherein the body is formed by uniformly covering the component areas for the plurality of modules with the dielectric material, such that the body is initially a single, continuous element that covers all of the plurality of component areas prior to exposing the exposed metallic structures. 
   
   
       18 . The method of  claim 1  wherein the metallic structures extend substantially about a periphery of each of the certain component areas. 
   
   
       19 . The method of  claim 18  wherein the bottom metallic element for each of the metallic structures comprises a continuous metal trace on the surface of the substrate and extending substantially about the periphery of each of the certain component areas. 
   
   
       20 . The method of  claim 18  wherein the bottom metallic element for each of the metallic structures comprises a discontinuous metal trace on the surface of the substrate and extending substantially about the periphery of each of the certain component areas. 
   
   
       21 . The method of  claim 18  wherein each of the metallic structures comprises a series of segments on the surface of the substrate and extending substantially about the periphery of each of the certain component areas.