Inventor · disambiguated record
Thomas Scott Morris
Also filed as: MORRIS THOMAS S · MORRIS THOMAS SCOTT
34 granted patents·14 pending applications·290 citations·filing 2003–2025
96Inventor score
Top patents by PatentIndex Score
48 records- 0197US9613831B2Encapsulated dies with enhanced thermal performanceRF MICRO DEVICES INC·Filed 2015·Granted Apr 4, 2017·64 cites·27 claims
- 0294US9960145B2Flip chip module with enhanced propertiesQORVO US INC·Filed 2016·Granted May 1, 2018·15 cites·25 claims
- 0394US7451539B2Method of making a conformal electromagnetic interference shieldRF MICRO DEVICES INC·Filed 2005·Granted Nov 18, 2008·89 cites·24 claims
- 0493US8434220B2Heat sink formed with conformal shieldRAO JAYANTI JAGANATHA·Filed 2007·Granted May 7, 2013·27 cites·22 claims
- 0591US9269887B1Ultrathin flip-chip packaging techniques and configurationsTRIQUINT SEMICONDUCTOR INC·Filed 2015·Granted Feb 23, 2016·17 cites·25 claims
- 0691US8835226B2Connection using conductive viasMORRIS THOMAS SCOTT·Filed 2011·Granted Sep 16, 2014·13 cites·12 claims
- 0791US8296941B2Conformal shielding employing segment buildupHINER DAVID J·Filed 2011·Granted Oct 30, 2012·10 cites·16 claims
- 0888US9661739B2Electronic modules having grounded electromagnetic shieldsRF MICRO DEVICES INC·Filed 2015·Granted May 23, 2017·6 cites·8 claims
- 0986US9137934B2Compartmentalized shielding of selected componentsMORRIS THOMAS SCOTT·Filed 2011·Granted Sep 15, 2015·11 cites·17 claims
- 1086US8959762B2Method of manufacturing an electronic moduleLEAHY DONALD JOSEPH·Filed 2011·Granted Feb 24, 2015·9 cites·23 claims
- 1185US10905007B1Contact pads for electronic substrates and related methodsQORVO US INC·Filed 2020·Granted Jan 26, 2021·2 cites·16 claims
- 1277US9646857B2Low pressure encapsulant for size-reduced semiconductor packageQORVO US INC·Filed 2016·Granted May 9, 2017·3 cites·22 claims
- 1377US9420704B2Connection using conductive viasRF MICRO DEVICES INC·Filed 2014·Granted Aug 16, 2016·3 cites·8 claims
- 1475US7999197B1Dual sided electronic moduleRF MICRO DEVICES INC·Filed 2009·Granted Aug 16, 2011·7 cites·21 claims
- 1574US10020206B2Encapsulated dies with enhanced thermal performanceRF MICRO DEVICES INC·Filed 2016·Granted Jul 10, 2018·2 cites·19 claims
- 1673US11387190B2Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulationQORVO US INC·Filed 2020·Granted Jul 12, 2022·1 cites·11 claims
- 1768US2025275107A1Compartmentalized shielding of a module utilizing self-shielded sub-modulesQORVO US INC·Filed 2025·Application pending·0 cites
- 1867US11765826B2Method of fabricating contact pads for electronic substratesQORVO US INC·Filed 2021·Granted Sep 19, 2023·0 cites·19 claims
- 1965US10888040B2Double-sided module with electromagnetic shieldingQORVO US INC·Filed 2018·Granted Jan 5, 2021·1 cites·14 claims
- 2064US12342518B2Compartmentalized shielding of a module utilizing self-shielded sub-modulesQORVO US INC·Filed 2023·Granted Jun 24, 2025·0 cites·18 claims
- 2163US9935066B2Semiconductor package having a substrate structure with selective surface finishesQORVO US INC·Filed 2016·Granted Apr 3, 2018·1 cites·17 claims
- 2263US2025118648A1Multilevel system-in-package module with embedded die and redistribution bottom featuresQORVO US INC·Filed 2024·Application pending·0 cites
- 2361US2025070042A1Module level compartmental integrated shieldingQORVO US INC·Filed 2024·Application pending·0 cites
- 2460US11058038B2Electromagnetic shields for sub-modulesQORVO US INC·Filed 2020·Granted Jul 6, 2021·0 cites·20 claims
- 2560US2025266800A1Acoustic resonator packageQORVO US INC·Filed 2024·Application pending·0 cites
- 2659US6884661B1Method of fabricating posts over integrated heat sink metallization to enable flip chip packaging of GaAs devicesRF MICRO DEVICES INC·Filed 2003·Granted Apr 26, 2005·8 cites·17 claims
- 2759US2024426682A1Semiconductor die level stress detection in package utilizing strain gauge structuresQORVO US INC·Filed 2024·Application pending·0 cites
- 2857US11219144B2Electromagnetic shields for sub-modulesQORVO US INC·Filed 2019·Granted Jan 4, 2022·0 cites·18 claims
- 2957US10607960B2Substrate structure with selective surface finishes for flip chip assemblyQORVO US INC·Filed 2019·Granted Mar 31, 2020·0 cites·21 claims
- 3056US2025022765A1Top side cooling for power amplifier moduleQORVO US INC·Filed 2024·Application pending·0 cites
- 3154US12231109B2Electronic device with solder interconnect and multiple material encapsulantQORVO US INC·Filed 2021·Granted Feb 18, 2025·0 cites·19 claims
- 3253US10777524B2Using an interconnect bump to traverse through a passivation layer of a semiconductor dieQORVO US INC·Filed 2018·Granted Sep 15, 2020·0 cites·19 claims
- 3353US8415567B1Forming soldering surfaces without requiring a solder maskSAWYER BRIAN D·Filed 2010·Granted Apr 9, 2013·1 cites·20 claims
- 3452US10283480B2Substrate structure with selective surface finishes for flip chip assemblyQORVO US INC·Filed 2016·Granted May 7, 2019·0 cites·20 claims
- 3551US9942994B2Connection using conductive viasRF MICRO DEVICES INC·Filed 2015·Granted Apr 10, 2018·0 cites·13 claims
- 3651US2010199492A1Conformal shielding employing segment buildupRF MICRO DEVICES INC·Filed 2010·Application pending·0 cites
- 3750US2023402333A1System in a package (sip) with air cavity and epoxy sealQORVO US INC·Filed 2023·Application pending·0 cites
- 3850US2024321707A1Electronic device comprising a single dielectric layer for solder mask and cavity and method for fabricating the sameQORVO US INC·Filed 2022·Application pending·0 cites
- 3947US2025349690A1Metal edge features on double-sided packagesQORVO US INC·Filed 2025·Application pending·0 cites
- 4047US2014146489A1Surface finish for conductive features on substratesRF MICRO DEVICES INC·Filed 2013·Application pending·0 cites
- 4146US10811364B2Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulationQORVO US INC·Filed 2019·Granted Oct 20, 2020·0 cites·10 claims
- 4246US2014021603A1Using an interconnect bump to traverse through a passivation layer of a semiconductor dieRF MICRO DEVICES INC·Filed 2013·Application pending·0 cites
- 4345US2017018520A1Using an interconnect bump to traverse through a passivation layer of a semiconductor dieQORVO US INC·Filed 2016·Application pending·0 cites
- 4442US11127689B2Segmented shielding using wirebondsQORVO US INC·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 4542US9897512B2Laminate variables measured electricallyMORRIS THOMAS SCOTT·Filed 2012·Granted Feb 20, 2018·0 cites·18 claims
- 4641US11024541B2Process for molding a back side wafer singulation guideQORVO US INC·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 4738US2012193781A1Customized rf mems capacitor array using redistribution layerCOSTA JULIO·Filed 2011·Application pending·0 cites
- 4836US10553545B2Electromagnetic shielding for integrated circuit modulesQORVO US INC·Filed 2017·Granted Feb 4, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →