Substrate processing system and substrate processing method

Abstract

Disclosed is a substrate processing method that dissolves and deforms a photoresist film having a first pattern formed on a substrate to reshape the resist film into a second pattern. During the reflow process, an atmosphere of a thinner vapor-containing gas is established in a processing chamber. A substrate is placed on a temperature adjusting plate. The target temperature of the temperature adjusting plate is set and controlled by a control unit, and the temperature of the temperature adjusting plate is controlled by a temperature regulator based on the target temperature set by the control unit. The control unit set and controls the target temperature so that it meets the following requirement: the atmospheric temperature≦the target temperature≦(the atmospheric temperature+2° C.). Due to the above, the reflowing of the resist can be performed stably, while achieving a satisfactory reflow rate although it is somewhat low.

1 . A substrate processing apparatus that dissolves and deforms a photoresist film having a first pattern formed on a substrate to reshape the resist film into a second pattern, said apparatus comprising:
 a processing chamber;   a temperature adjusting plate arranged in the processing chamber, the temperature adjusting plate having a substrate supporting surface on which a substrate is to be placed;   a temperature regulator adapted to control a temperature of the substrate supporting surface to coincide with a target temperature of the substrate supporting surface so as to control a temperature of the substrate;   a solvent supply system adapted to supply an atmosphere containing a solvent, the solvent having an ability to dissolve a photoresist film;   an atmospheric temperature sensor adapted to detect an atmospheric temperature in the processing chamber; and   a control unit adapted to receive a detection signal expressing an atmospheric temperature in the processing chamber detected by the atmospheric temperature sensor, and adapted to set the target temperature of the substrate supporting surface, the control unit being configured to compare the target temperature which is being set at that time with the atmospheric temperature detected by the atmospheric temperature sensor and controls the target temperature based on a comparison result.   
   
   
       2 . The substrate processing apparatus according to  claim 1 , wherein the control unit is configured to controls the target temperature so as to satisfy the following condition: the atmospheric temperature≦the target temperature≦(the atmospheric temperature+2° C.).