Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same

Abstract

An electronic device having a bonding pad structure and a method of fabricating the same is provided. The electronic device may include a first bonding pads formed on the substrate. A second bonding pad may be formed on the lower insulating layer. The second bonding pads may be spaced apart from the first bonding pads. The second bonding pads may have a top surface formed at a higher level than the first bonding pads.

1 . A bonding pad structure, comprising:
 a first bonding pad on a substrate; and   a second bonding pad spaced apart from the first bonding pad, wherein the second bonding pad has a top surface at a higher level than the first bonding pad.   
   
   
       2 . The bonding pad structure according to  claim 1 , wherein the second bonding pad has a first region at a same level as the first bonding pad and a second region at a higher level than the first bonding pad, the second region having a greater width than that of the first region. 
   
   
       3 . The bonding pad structure according to  claim 1 , wherein the first bonding pad and the second bonding pad have bottom surfaces at a same level. 
   
   
       4 . The bonding pad structure according to  claim 1 , further comprising: an insulating layer interposed between the first bonding pad and the second bonding pad, wherein the insulating layer has a top surface at a higher level than the first bonding pad. 
   
   
       5 . The bonding pad structure according to  claim 4 , wherein the second bonding pad covers a portion of a top surface of the insulating layer. 
   
   
       6 . The bonding pad structure according to  claim 1 , further comprising: an insulating spacer on a side wall of the second bonding pad. 
   
   
       7 . The bonding pad structure according to  claim 6 , wherein the insulating spacer covers the side wall of the second bonding pad and a portion of the first bonding pad. 
   
   
       8 . An electronic device, comprising:
 the bonding pad structure according to  claim 1  including at least two first bonding pads and at least two second bonding pads;   a lower insulating layer on the substrate, wherein the first bonding pads pass through the lower insulating layer; and   an upper insulating layer on the lower insulating layer around the first bonding pads, wherein the second bonding pads sequentially pass through the upper insulating layer and the lower insulating layer.   
   
   
       9 . The electronic device according to  claim 8 , further comprising:
 an interlayer insulating layer interposed between the substrate and the lower insulating layer; and   metal patterns passing through the interlayer insulating layer, wherein the metal patterns are electrically connected to the first bonding pads and the second bonding pads.   
   
   
       10 . The electronic device according to  claim 8 , wherein each of the first bonding pads covers a portion of a top surface of the lower insulating layer. 
   
   
       11 . The electronic device according to  claim 8 , wherein the upper insulating layer covers a portion of top surfaces of the first bonding pads. 
   
   
       12 . The electronic device according to  claim 8 , wherein the second bonding pads cover a portion of a top surface of the upper insulating layer. 
   
   
       13 . The electronic device according to  claim 8 , further comprising:
 insulating spacers on side walls of the second bonding pads.   
   
   
       14 . The electronic device according to  claim 13 , wherein the insulating spacers cover the side walls of the second bonding pads and a portion of the first bonding pads.